文档介绍：该【PCB专业术语 】是由【青山代下】上传分享，文档一共【17】页，该文档可以免费在线阅读，需要了解更多关于【PCB专业术语 】的内容，可以使用淘豆网的站内搜索功能，选择自己适合的文档，以下文字是截取该文章内的部分文字，如需要获得完整电子版，请下载此文档到您的设备，方便您编辑和打印。:..专业术语写全称中文CALCalibration仪教CLChemicalLaboratory化验室FVFinalVisualInspection最后目视查验CQECustomerQualityEngineer客服工程师IPQCInProcessQualityControl制程质量管控ingQualityControl进料质量管控OQCOutgoingQualityControl出货物质管控OQAOutgoingQualityAssurance出货物质保证QAQualityAssurance质量保证部RELLABReliabilityLaboratory信任性实验室QMSQualityManagementSystem质量管理系统VQAVendorQualityAssurance供给商质量保证SQESupplierQualityEngineer供给商质量工程师MISManagementInformationSystem管理信息系统DCCDocumentControlCenter文管中心HRHumanResources人力资源部FIFinance财务部MKTMarketing市场营销部PURPurchasing采买部MAINMaintenance保护部GMGeneralManager总经理GMGeneralMotors通用汽车VPVicePresident副总CEOChiefExecutionOffice履行总裁/首席履行官CFOChiefFinancialOfficer财务总监WTWasteTreatment废水办理部PPEPre-productionEngineering试生产部TDTechnologyDevelopment技术开发部缩写全称中文R&DResearch&Development研发部PEProcessEngineering工程部PCProductionControl生管部:..专业术语TSTraffic&ShippingETElectricalTest电性测试ENIGElectrolessNickelandImmersionGold化学镍金AOIAutomatedOpticalInspection自动光学检测B/OBlackOxide黑氧化HASLHotAirSolderingLevel热风整平/喷锡PTHPlatedThroughHole镀通孔DFDryFilm干膜DESDevelop,Etch&Stripping显影,蚀刻,除胶EHSEnvironmentHealth&Safety环境保护部DPDirectPlating直接电镀B/FBondFilm/BrownOxide棕化I/LInnerLayer内层线路O/LOuterLayer外层线路S/MSolderMask防焊P/:..专业术语FMEAFailureModeAndEffectAnalysisIPCTheInstituteForInterconnection&美国电子电路互连及ircuits封装协会anizationforISO国际标准化组织Standardization/InternationalanizationJITJustInTime实时MPIManufacturingProcessInstruction制程作业说明书SOPStandardOperationProcedure标准操作规范SPCStatisticalProcessControl统计制程管束6ó6Sigma6个标准差CPCAChinaPrintedCircuitAssociation中国印刷电路板协会TPCATaiwanPrintedCircuitAssociation台湾印刷电路板协会JPCAJapanPrintedCircuitAssociation日本印刷电路板协会R&RRepeatability&Re-productivity重复性&再现性A/WArtwork底片OPOperationInstruction操作说明IPAIsopropylAlcohol异丙醇ontamination离子污染度ICIntegratedCircuit集成电路BGABallGridArray球形栅格阵列缩写全称中文AAAtomicAbsorptionSpectrophotometer原子汲取光谱仪CVSCyclicVoltametricStripping循环伏安剥离剖析仪ICIonChromatography离子液相色谱OGPOpticalGaugingProducts光学计量器/:..专业术语CARCorrectiveActionRequestR/WRework重工MRBMaterialReviewBoard需确认之问题板SPECSpecification规格A/RActionRequired待做事项SMDSurfaceMountDevice表面贴装装置WIPWorkInProcess在制品HDIHighDensityInterconnecting高密度互连UVUltravioletSpectrophotometer紫外光分光光度计pressedandDriedAir压缩气CTCoolingTower冷却塔CTWaterCityWater市水/自来水DBDistributionBoard配电屏DIWaterDe-ionizedWater去离子水FWFilteredWater过滤水M/CMachine机台缩写全称中文PCBPrintedCircuitBoard//eBack印刷线路板//收益到来SSBSingle-sidedPrintedBoard单面印制板DSBDouble-sidedPrintedBoard双面印制板MLBMultilayerPrintedCircuitBoard多层线路印制板ROWaterReverseOsmosisWater反浸透水ROFReverseOsmosisFilter反浸透过滤器SWSoftWater软水TEMPTemperature温度TPMTotalPreventiveMaintenance整体预防性保护A/ountReceivable应收款项A/ountPayable对付款项CARCapitalAcquisitionRequest资本获取申请DMDirectMaterial直接物料IDMIndirectMaterial间接物料FIFinanceModule财务模块P&LProfit&Loss盈亏PBTProfitBeforeTax税前收益:..专业术语COCostingModule(SAP)OSOutstanding优异ERExceedImprovement优异MRMeetRequirement优异NINeedImprovement待改良eptable不行接受ASAPAsSoonAsPossible尽可能快地D/CDateCode周期DOEDesignofExperiment实验设计ERPEnterpriseResourcePlanning公司资源规划KPIKeyPerformanceIndex主要绩效指标缩写全称中文MCSManagementControlSystem管理控制系统MRMaterialRequest物料申请PCBAPrintedCircuitBoardAssembly电路板组装P/NPartNumber板号/料号POPurchaseOrder采买单P&PPick&Place贴片机PRPurchaseRequisition采买申请SMTSurfaceMountTechnology表面贴装技术S/OSalesOrder业务单/销售单V/OVariationOrder变异单F/OFacilityOrder工厂号NPTHNon-platedThroughHole非导通孔EDSEngineeringDateSheet工程数据单ECNEngineeringChangeNotice工程更改单PCB/PWBPrintedCircuitBoard/PintedWiringBoard印刷电路板MCPMetallizationContinuousPlating垂直连续电镀D/SDoubleSide双面板D/ODeliveryOrder送货单RCCResinCoatedCopper背胶铜箔QFPQuarterFlatPad四方形焊盘MSAMeasurementSystemAnalysis量测系统剖析MLBMultilayerPrintedBoard多层印制板:..专业术语CCLCopper-cladLaminatePTFEPolytetrafluoethylene聚四***乙稀BCSButylCellosolveSolvent防白水KLMKeyLineManager主要负责人BUMBuild-upMultilayer积层法多层板DSCDifferentialScanningCalorimetry微差扫描热卡剖析法缩写全称中文DMADynamicMechanicalAnalysis动向力剖析法IAInformationAppliance信息家电LPSMLiquidPhotoimagibleSolderMask液态感光油墨PGAPinGridArray针栅阵列PBGAPlastic-(小于20mil)PlugHole堵孔AnnularRing孔环Slothole槽孔Traveler流程单BuyOff抽检Develop显影Legend文字GoldPotassiumCyanide金盐Routing铣切:..专业术语Silver英文中文Gold金anicSolderabilityPreservative)有机保护膜LineWidth线宽LineSpace线间距BoardThickness板厚HoleSize孔径Trace线路Drilling钻孔Impedance阻抗BarCode条形码AcidClean酸洗De-warpage板弯翘反直/改正MasterDrawing宏图Defect缺点HotAirRepaidDryingOven迅速烘箱Carton箱子BlindVia盲孔CopperFoil铜箔Tolerance公差X-Out打叉Customer客户PinGauge量规/针规/塞规SolderingIron电烙铁SolderabilityTest焊锡性实验FinalFinish表面办理Warehouse库房Wicking渗镀/灯芯效应LaserHole镭射孔英文中文ShippingBuy-off出货抽检FilmAdhesive粘结膜Warehouse库房:..专业术语AuSeepageLaserHole镭射孔VerticalDesmear垂直除胶渣ShippingBuy-off出货抽检ScrappedBoard报废板Audit稽核Stamping冲压C=0SamplingPlan零缺点抽样计划Layup&Press叠合&压合Touchup/Repair修理SmearResidue胶渣残留ImmersionSilver沉银10XEyeLupe10X放大镜TapeTest胶带试验ept有条件允收Quarantine隔绝StopShipping停止出货OnHold暂扣Stamp印章ToolingHole定位孔ComponentHole元件孔MountingHole安装孔Production产品TestBoard测试板Conductor导线英文中文X-Section/Microsectioning切片FisrstArticleInspection首件/初片检查FinalCure最后烘烤RigidPrintedBoard刚性印制板Build-upMultiplayerPrintedBoard积层多层印制板FlexiblePrintedBoard挠性印制一路板MotherBoard/MouseBite母板DaughterBoard子板:..专业术语BackPlaneBoardBareBoard裸板Cable电缆Interconnection互连TransmissionLine传输线Substrate基底ConductivePattern导电图形Non-conductivePattern非导电图形BaseMaterial基板Laminate层压板CompositeLaminate复合层压板ThinLaminate薄层压板BondingSheet粘结片StiffenerMaterial加强板材EpoxyResin环氧树脂RoundPad圆形盘GlassFiber玻璃布Yarn纱线Filament单丝WeftYarn纬纱英文中文WarpYarn经纱Wasp-wise经向Split裂痕ReworkSimulation模拟重工SquarePad方形盘DiamondPad棱形盘OblongPad长方形焊盘SupportdHole支撑孔BuriedViaHole埋孔Buried/BlindVia埋/盲孔CheckList点检表HoleLocation孔位HoleDensity孔密度:..专业术语HolePattern孔图DatumReference参照基准Acceleration速化反响Integrity完好性Accuracy正确度Acrylic亚克力BlowHole吹孔BareChipAssembly赤身芯片组装BondStrength联合强度Bondability联合性BondingWire联合线BreakawayPanel可断拼板BreakdownVoltage崩溃电压/击穿电压Burr毛头/毛刺ChemicalResistance抗化学性中文Chip芯片Alcohol酒精MoistureAndInsulationResistance湿气与绝缘电阻CoreBoard芯片/中心核Deburing去毛刺Dent凹陷Deposition堆积/积蓄Desmear除胶渣DielectricBreakdown介质崩溃onstant介质常数DimensionalStability尺寸稳固性DrillFacet钻尖切削面Edge-BoardConnector板边连结器Edge-BoardContace板边插头NegativeEtchback反回蚀ElectrolessDeposition化学镀/无电镀Etchback回蚀EtchFactor蚀刻因子:..专业术语EtchingResistGelTime凝胶时间GelationParticle凝胶点HoldingTime逗留时间HoleWallBreakout孔偏破HoleDensity孔密度HoleVoid孔壁空洞HullCell哈氏槽Imaging成像Logo表记英文中文LeakageCurrent漏电流LiftedLand焊垫浮起Measling白点/白斑MinimumAnnularRing最小环宽LaserAblation镭射烧孔GeneralRequirement概括性要求Nodule节瘤Non-wetting不沾银Nylon尼龙Outgassing出气Outgrowth侧出OverPotential过电位PanelPlating全板电镀PeelStrength剥离强度Permittivity介电常数PorosityTest孔隙度试验PatternPlating图形电镀QualityConformanceTest质量切合试验Registration瞄准度Resist阻剂Resolution解像ReverseImage片影像Ring套环:..专业术语Scratch刮伤Shadowing暗影SolderConnection焊点SolderPaste锡膏ResinRecession树脂内缩中文SolidContent固体含量SprayCoating发射涂装Stripper玻璃液ThermalConductivity导热率ThermalShockTest热冲击试验TinIndicated浸锡V-CutV型切槽VacuumEvaration(orDeposition)真空镀膜法Varnish树脂漆VoltageBreakdown击穿电压WeaveExposure织纹显现WeaveTexture织纹隐现WedgeVoid楔形空洞Wetting//Non-wetting沾锡/不沾锡Wicking灯芯效应/:..专业术语中文B-StageOverSpecB-Stage过厚Delamination分层/爆板RoughEdge板边粗拙Wrinkle折皱WrongLayUp内层放反FingerPrint手指印ShiftHole孔偏移BlockedHole孔堵HoleUnder/OverSize孔尺寸过大/过小MissingHole漏钻孔TapeResidue残胶RoughHole孔粗拙NotThroughHole孔未钻透HoleBreakout孔破LaserShift镭射孔偏移ExtraHole多孔Oxidation氧化Pitting针点VoidInHole孔内空洞VoidOnPadPAD空洞FilmBreakdown膜破UnderDevelop显影未尽ExposeCopper/Nickel露铜/镍PoorVacuum抽真空不良EpoxySmear去毛刺未净NailHeading钉头Crack龟裂PostSeparation内层断开英文中文DamagedHole孔破坏SmearResidue胶渣残留BurntPlating电镀烧焦PinkRing粉红圈S/MOnPad油墨上PAD:..专业术语S/MShift油墨偏移S/MVacuum抽真空不良S/MSkip油墨未印下S/MLump积墨S/MInHole孔内油墨S/MBubble油墨气泡Stain肮脏PoorRework重工不良OverBaking烘烤过分ForeignMaterial/Inclusions外来杂物PeelableInkOnPad可剥胶上PADLegendShift文字偏移IllegibleLegend文字不清LegendOnSurface板面沾白漆ExcessLegend剩余的文字CarbonExposeCu碳油墨露铜CarbonShort/Open/Smear/Skip碳油墨短/断路/散开/遗漏UnderPlugHole堵孔不足PlugholeCrack堵孔裂开MissingSolder漏镀锡SolderLump焊锡短路RoughSolder焊锡隆起T/LOnTrace锡面粗拙中文T/LInTrace焊锡上线条T/LInViaHole孔内沾锡BlockHole堵孔PoorSolderability焊锡性不良Discolor变色AuSeepage金渗镀AuPeeling金零落Tarnish金面发黄Scratch刮伤RoughEdge板边粗拙Burr毛刺:..专业术语Pit/Dent/凹陷Oxidation氧化MaterialDamage资料破坏LiftedFeature导体翘起ForeignMaterial杂质PadUndersizedPAD尺寸不够PadMissingPAD丢掉PadDamagedPAD损坏PTHVoid镀通孔空洞NoPunchOutsAllowed冲型不良Dewetting拒锡SolderDull锡面发白SkipPlate跳镀GoldonFeature板面沾金GoldBlush金面发红NickelExposed露镍NickelAdhesion镍零落英文中文GoldScratch金面刮伤Feathering导体桥接pleteSolderStrip剥锡不净PlatingDouble重镀PlatingCrack龟裂PlatingNodule电镀颗粒TentBroken二次孔膜破pleteResistStrip剥膜不净ETStampWrongET章错误ETStampMissing漏ET章ETStampIllegibleET章模糊ILRegistration内层偏位ILcopperExposed内层露铜CopperExposed露铜Delamination分层LegendMissing文字漏印ReducedAperture防焊圈减小:..专业术语HoleBreakout孔破HoleExtra多孔S/:..专业术语RolledCopperFoil压延铜箔Computer--AidedManufacturing计算机协助制造ComputerControlledDisplay计算机控制设计DesignOrigin设计原点中文ircuit逻辑电路EngineeringDrawing工程图SeparatedLayer分层SolderConnection焊接点Rigid--CorrosionTesting电腐化测试DielectricWithstandingVoltage耐电压测试HotStorageTest高温积蓄测试Thermalshocktest热冲击测试Moisture&InsulationTest湿度缘测式ReworkSimulation模拟重工测式