文档介绍：Electrochemical and Solid-State Letters, 6 ͑5͒ C67-C69 ͑2003͒ C67
0013-4651/2003/6͑5͒/C67/3/$ © The Electrochemical Society, Inc.
Superconformal Silver Deposition Using Derivatized
Substrates
B. C. Baker,a,*,z C. Witt,b D. Wheeler,a D. Josell,a and T. P. Moffata,*
aNational Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA
bInternational Sematech, Austin, Texas
Superconformal filling of submicrometer trenches was achieved using substrates that were catalyzed with prior to metal
deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was dependent on the time the specimen spent in
the -containing solution prior to electrodeposition. Longer derivatization times correspond to higher initial catalyst cov-
erages. The feature filling results were consistent with the curvature enhanced accelerator coverage mechanism of superconformal
deposition. This mechanism implies that area changes during deposition in a feature lead to higher catalyst coverage at the bottom
of the feature, thus enhancing the deposition rate and allowing bottom-up fill.
© 2003 The Electrochemical Society. ͓DOI: All rights reserved.
Manuscript submitted November 13, 2002; revised manuscript received January 15, 2003. Available electronically February 28,
2003.
essful implementation of copper interconnect metalliz