文档介绍：华中科技大学
硕士学位论文
汽车用全桥式压阻型压力传感器信号调理芯片的研究
姓名:唐益谦
申请学位级别:硕士
专业:精微制造工程
指导教师:刘胜
20080603
摘要
硅微机械压阻型压力传感器已经有30年的发展历史,从最初的硅杯结构到后来的硅
盒结构,其外形越来越精巧,性能越来越可靠,应用的范围也越来越广。汽车电子是其
很重要的一个应用领域。与传统的压力传感器相比,微机械压阻型压力传感器具有可大
批量生成制造、小尺寸、低价格等特点,这些都是汽车电子的关键因素。然而这种传感
器具有显著的温度效应,因此需要对其进行温度补偿。
本文主要研究压阻型压力传感器信号调理芯片的设计,该芯片的关键是与温度相关
的电路以及放大级电路的设计。与温度相关的电路补偿传感器的温度非理想特性,包括
灵敏度温度补偿以及零点温度补偿;放大级对传感器微弱的信号进行放大处理,以达到
所需要的信号输出要求。另外,芯片包含通信接口、存储器等数字辅助电路。
本文阐述了传感器温度效应产生的原因,提出了一种新的补偿方法。在此基础上,
设计了传感器信号调理芯片。重点讲述了带隙基准、正温度系数电压、斩波放大器以及
增益可调开关电容放大器的基本原理,并且根据要求设计相应的电路,给出相应的仿真
结果。
最后,利用所设计的芯片,对传感器进行信号调理。选取三个样品,做了温场方面
的测试,测试结果表明,在整个温场内,传感器精度保持在1%~3%以内,完全达到预
期的设计要求。

关键词:汽车电子扩散硅压力传感器温度补偿带隙基准斩波放大器
开关电容放大器
I
Abstract
The silicon micromachined piezoresistive pressure sensors have been developed for
more than 30 years. From the primary structure of silicon-cup to recent structure of
silicon-box, the pressure sensors e more miniatured, more reliable, and broader
applications have been found in many different fields especially in automotive electronics.
Compared to traditional pressure sensors, micromachined pressure sensors are featured with
high volume, small size, low cost which are the most important factors in automotive
applications. This kind of pressure sensors, however, have higher temperature sensitivity,
pensation is therefore necessary.
This thesis focuses on the design of signal conditioning circuit for piezoresistive pressure
sensor. The key point of this chip is the design of Bandgap, PTAT (Proportional to Absolute
Temperature) voltage and Amplifier. PTAT pensates for the sensor’s temperature
effect which contains temperature coefficient sensitivity (TCS) and temperature coefficient
offset (TCO). The pressure sensor’s signal is then amplified to meet the required output. This
chip also munication interface and memory function.
This thesis explains the fundamental causes of temperature effect of piezoresistive
pressure senso