文档介绍：EE1411?Digital Integrated Circuits2ndManufacturingDigital Integrated Digital Integrated CircuitsCircuitsA Design PerspectiveA Design PerspectiveManufacturingManufacturingProcessProcessJan M. RabaeyAnanthaChandrakasanBorivojeNikolicJuly 30, 2002PDF created with FinePrint pdfFactory Pro trial version 12?Digital Integrated Circuits2ndManufacturingCMOS ProcessCMOS ProcessPDF created with FinePrint pdfFactory Pro trial version 13?Digital Integrated Circuits2ndManufacturingA Modern CMOS ProcessA Modern CMOS Processp-welln-wellp+p-epiSiO2AlCupolyn+SiO2p+gate-oxideTungstenTiSi2DualDual--Well TrenchWell Trench--Isolated CMOS ProcessIsolated CMOS ProcessPDF created with FinePrint pdfFactory Pro trial version 14?Digital Integrated Circuits2ndManufacturingCircuit Under DesignCircuit Under DesignVDDVDDVinVoutM1M2M3M4Vout2PDF created with FinePrint pdfFactory Pro trial version 15?Digital Integrated Circuits2ndManufacturingIts Layout ViewIts Layout ViewPDF created with FinePrint pdfFactory Pro trial version 16?Digital Integrated Circuits2ndManufacturingThe Manufacturing ProcessThe Manufacturing ProcessFor a great tour through the IC manufacturing process and its different steps, checkiconductors/ created with FinePrint pdfFactory Pro trial version 17?Digital Integrated Circuits2ndManufacturingoxidationopticalmaskprocessstepphotoresistcoatingphotoresistremoval (ashing)spin, rinse, dryacid etchphotoresiststepper exposuredevelopmentTypical operations in a single photolithographic cycle (from [Fullman]).PhotoPhoto--Lithographic ProcessLithographic ProcessPDF created with FinePrint pdfFactory Pro trial version 18?Digital Integrated Circuits2ndManufacturingPatterning of SiO2Patterning of SiO2Si-substrateSi-substrateSi-substrate(a) Silicon base material(b)After oxidation and depositionof negative photoresist(c) Stepper exposurePhotoresistSiO2UV-lightPatternedoptical maskExposed resistSiO2Si-substrateSi-substrateSi-substrateSiO2SiO2(d)After development and etchingof