文档介绍：White Paper: Xilinx FPGAs
R
WP192 () May 12, 2003
SMT Package Rework
By: Quang (Peter) Nguyen
Surface Mount Technology (SMT) packages include the
leaded family packages (Quad Flat Pack (QFP) and Plastic
Leaded Chip Carrier ()) and the Ball Grid Array
(BGA) packages. SMT rework can be necessary for any of
the following reasons: assembly related defects, such as
shorts, opens, wrong orientation, and solder ball defects;
device/package related defects/failure analysis; and
engineering change or system upgrade.
This white paper contains guidelines for the rework
process, but does not guarantee the ess of every
rework process. Note that a maximum of three reflow
cycles (including initial assembly, rework, and reballing)
are allowed.
For information on reworking flip-chip packages, refer to
Xilinx application note XAPP426.
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at .
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
WP192 () May 12, 2003
1-800-255-7778
R White Paper: SMT Package Rework
Leaded Reworking the leaded packages can be quite straightforward. Because of the absence of plated
Package (QFP through-holes, ponents are easier to remo