文档介绍：大功率白光LED封装设计与研究进展
陈明祥
摘要:由于封装设计、材料和结构的不断创新使LED性能不断提高。本文从光学、热学、电学、机械、可靠性等方面,详细评述了大功率白光LED封装的设计和研究进展,并对封装材料和工艺进行了具体介绍。提出LED的封装设计应与芯片设计同时进行,并且需要对光、热、电、结构等性能统一考虑。在封装过程中,虽然材料(散热基板、荧光粉、灌封胶)选择很重要,但封装工艺(界面热阻、封装应力)对LED光效和可靠性影响也很大。
关键词:固态照明;大功率LED;白光LED;封装
Innovative advances in packaging design and research of high-power white LED
Abstracts: Innovative designs, materials and structures of packaging have led to dramatic improvements of the performance in LED technology, round breaking performance records are being reported constantly. An overview of the rapid progresses in packaging design and research of high-power white light emitting diodes (LEDs) is presented. This article summaries the packaging designing of LED in optics, thermal, electrics, mechanics and reliability, and introduces the packaging material ands processes in details. It is proposed that packaging and chip of LED should be co-designed, and the effect of optical, thermal, electrical and mechanical should be considered at the same time. Although it is important to choose the packaging materials (such as thermal spreading substrate, phosphors and silicone), the interface thermal resistance and thermal stress resulted in packaging processes have great affect on the optical efficiency and reliability of packaged LED.
Keywords: Solid State Lighting, high-power LED, White LED, Packaging
前言
LED制造流程一般分为前道工序(芯片制作)和后道工序(