文档介绍：摘要
本课题结合纵向科研项目“集成电路塑封自动上料机研制”研究需要,首先进行了课题总体技术方案设计,然后进行了集成电路芯片塑料封装自动上料系统的机架部件结构设计及性能试验方案的拟定。自动上料系统的研制实现了集成电路塑封的自动化,该系统适用于DIP、QFP、SOP、TO等系列集成电路芯片的塑封生产,可显著提高生产效率及产品质量。自动上料系统主要由料片传送部件、料片自动排片部件、工控机系统、传感检测系统及上料机机架部件等组成。上料机机架部件采用钣金结构制造,结构简单且使用方便。上料机机架部件作为上料机一个重要的基础结构部件,起到支撑工作台、安装和保护电子设备内部各种电路单元、电气元器件等重要元件的作用。
关键词:集成电路,塑封,上料,自动化,机架部件
ABSTRACT
Based on the longitudinal research topic “IC Plastic automatic feeding machine” research needs, firstly the issue of the overall technical program was designed, then the IC chip plastic packages automatic feeding system on the ponents was designed and the performance was tested. An automatic leader system was designed that realized automation for plastic package of integrated circuit. The system can be applied to the plastic package for DIP、QFP、SOP and TO series integrated circuits. The production efficiency and the product quality would be improved greatly. The system consists mainly of ponents, materials unit automatic film parts, puter systems, sensing detection system and the ponents and so on. The ponents of the automatic feeding machine was made by Sheet-metal structure, the structure is simple and easy to use. The ponents as an important ponents of the feeding machine, it play a role in supporting workstations, installation and protection of electronic equipment within various circuit modules, ponents and other ponents.
Key words: Integrated circuit, Plastic package, Load, Automation, ponents
目录
摘要 I
ABSTRACT II
第一章绪论 1
1
2
2
第二章集成电路封装概述 4
集成电路 4
概念 4
类型 4
集成电路在我国的发展状况 5
集成电路封装 5
封装的发展 5
塑料封装 7
环境因素对封装的影响 7
封装设备 9
集成电路芯片塑料封装设备 9
国内外集成电路塑封设备的概况 10
机电一体化系统(产品)的设计 10
第三章上料机系统设计 12
系统总体设计 12
12
12
14
14
14
15
17
第四章结论与展望 20
参考文献 21
致谢 22
第一章绪论
课题研究的现状及发展趋势
集成电路(IC)是现代信息产业和信息社会的基础,是