文档介绍：摘要
本文研究了 RFID(Radio Frequency Identification,射频识别)标签封装设备中预
贴片系统的设计、分析与实现。预贴片系统主要功能是通过倒装贴片工艺将 RFID 芯
片倒扣于天线基板上,实现芯片与天线的电气和机械连接,其性能直接影响到最终
RFID 标签的质量。
论文对预贴片系统的整体结构进行了分析,将系统划分为四个机构:芯片送料机
构、翻转头机构、贴片机构和 XY 运动平台,主要对多吸嘴转盘式贴装头进行了设计。
提出了满足技术指标要求的整体设计方案。
由于预贴片系统两个翻转头和两个贴装头机构在工作空间中存在干涉,使用
Deneb/Envision 软件对预贴片系统进行了芯片封装过程的运动学仿真,根据仿真结果,
本文设计了系统的运动时序,在确保系统运动过程中不发生干涉情况下,使预贴片系
统达到了预期的生产效率。此外,还根据仿真结果,确定了翻转头最小转动加速度,
以保证两个翻转头共用一个芯片送料机构不影响整个系统效率。
由于预贴片系统要求速度快,因此采用了同步带定位系统。为了研究同步带定位
系统的振动情况,本文建立了同步带定位系统的简化模型,并将模型的仿真结果与实
验结果进行了比较与分析。动力学仿真结果显示,同步带定位系统系统在驱动力发生
跳跃时,负载的加速度出现振动。
针对设备开发中控制程序复杂,团队开发而硬件资源不足的情况,本文提出了一
种将仿真过程中编写的控制代码直接移植到控制系统中的方法。文中采用组件的方
法,对系统原型进行了实现。
关键词: RFID 标签倒装贴片运动学仿真动力学仿真控制编程
I
Abstract
The pre-bonding system, the ponent of the RFID packaging equipment, is
designed, analyzed and realized in this thesis. The main function of the system is that the
chips are picked and placed on the pad of the antennas using flip chip technology to realize
the electric and mechanic connection. The performance of the pre-bonding system directly
affects the quality of the RFID tag.
The whole configuration of the system is analyzed. It consists of four machines:
chip-feeder, flip-head, pick-and-place head and X-Y gantry. A multi-nozzle rotating head is
designed. A scheme of this system which can satisfy the efficiency requirement is
proposed.
Because of the intervention of the machine in the work space, the kinematics
simulation of the chip packaging procedure is implemented in the Deneb/Envision software
environment. The motion sequence of the system is designed according to the simulation
result in order to achieve the high efficiency of the production in the case of avoiding
collision. In addition, the minimum acceleration of the two flip-heads that doesn’t affect the
efficiency of the equipment with one chip-feeder is calculated out.
Timing belt position system is used in the pre-bonding system. To research into the
vib