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Zant, P.v. - Microchip fabrication (5th ed., McGraw-Hill, 2004).pdf

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Zant, P.v. - Microchip fabrication (5th ed., McGraw-Hill, 2004).pdf

文档介绍

文档介绍:Table of Contents
Chapter 1 The Semiconductor Industry -------------------- 2
Chapter 2 Properties of Semiconductor Materials and
Chemicals ----------------------------------------------------- 26
Chapter 3 Crystal Growth and Silicon Wafer
Preparation --------------------------------------------------- 52
Chapter 4 Overview of Wafer Fabrication ----------------- 72
Chapter 5 Contamination Control --------------------------- 92
Chapter 6 Productivity and Process Yields ----------------- 140
Chapter 7 Oxidation ----------------------------------------- 160
Chapter 8 The Ten-Step Patterning Process—Surface
Preparation to Exposure ------------------------------------- 198
Chapter 9 The Ten-Step
Patterning Process—Developing to Final Inspection -------246
Chapter 10 Advanced Photolithography Processes --------284
Chapter 11 Doping --------------------------------------------326
Chapter 12 Layer Deposition --------------------------------366
Chapter 13 Metallization ------------------------------------402
Chapter 14 Process and Device Evaluation -----------------436
Chapter 15 The Business of Wafer Fabrication -----------482
Chapter 16 Introduction to Devices and Integrated
Circuit Formation--------------------------------------------- 514
Chapter 17 Introduction to Integrated Circuits -----------554
Chapter 18 Packaging ----------------------------------------570
Source: Microchip Fabrication
Chapter
1
The Semiconductor Industry
Overview
In this chapter, you will be introduced to the semiconductor industry
with a description of the historic product and process developments
and the rise of semiconductors into a major world industry. The major
manufacturing stages, from material preparation to packaged prod-
uct, are introduced along with the mainstream product types, transis-
tor building structures, and the different integration levels. Industry
product and processing trends are identified.
Objectives
pletion of this chap