文档介绍：Source: ELECTRONIC FAILURE ANALYSIS HANDBOOK
Part
1
Introduction to Electronic Failure
Analysis
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Introduction to Electronic Failure Analysis
Downloaded from Digital Engineering Library @ McGraw-Hill ()
Copyright © 2004 The McGraw-panies. All rights reserved.
Any use is subject to the Terms of Use as given at the website.
Source: ELECTRONIC FAILURE ANALYSIS HANDBOOK
CHAPTER 1
OVERVIEW OF ELECTRONIC
COMPONENT RELIABILITY
D. David Dylis
IIT Research Institute (IITRI)
INTRODUCTION
Failure analysis is the process of determining the cause of failure, collecting and analyzing
data, and developing conclusions to eliminate the failure mechanism causing specific
device or system failures. Failures can occur throughout a product’s life cycle. These fail-
ures can result from design, workmanship, components and manufacturing processes,
overstress, and maintenance. Table generically outlines factors affecting reliability.
Table Distribution of Factors Affecting Reliability1
Factor Failure percentage
Maintenance shop 17
Hardware reliability 16
Retest OK 28
Design 21
Quality 18
It is all too often that a failure analyst has limited information concerning the cause of a
failure. Details surrounding the cause will not only aid the analyst in the failure analysis
process, but the results of the analysis also will be more meaningful pleted. A
failure reporting, analysis, and corrective action system (FRACAS), as described in Chap-
ter 2, is used by anizations to track failures associated with their products. A
FRACAS can provide the valuable information necessary to perform plete and accu-
rate failure analysis. When data is not available, the analyst may take the role of a “private
investigator” to determine details surround