文档介绍：CONTENTS
1. SHIPPING, STORAGE and PRODUCTION ENVIRONMENT 2
General shipping and storage conditions 2
Storage and handling conditions for solder paste 2
Storage conditions for underfill epoxy materials 3
Storage and handling conditions for printed wiring boards [PWBs] 4
Shelf life time for ponent categories 5
Drying (baking) moisture sensitive devices 6
2. PASTE SPECIFICATIONS 7
3. STENCIL PRINTING PROCESS SPECIFICATIONS 8
Squeegee 8
Stencil 8
Support tables 9
Printing process parameters (stencil printing) 10
4. Statistical Printing Process Control, SPPC 11
Alarm and control limit settings 11
Actions when the machine alarms 12
Handling of statistical process information 12
5. AUTOMATED OPTICAL INSPECTION, AOI 12
Location of the machine in the production line 12
Utilisation of inspection results 12
and paste alarm limits 12
6. Reflow soldering process specification 13
Profile measurement equipment 13
Reflow profile measurement method 13
Reflow profile specification 14
mended reflow oven settings 15
7. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA 15
Manual and semi-automatic hot gas soldering and rework 15
Manual soldering and rework using soldering iron 16
CSP rework 16
Specifications for visual inspection; error criteria, faults classification and training material 17
8. Underfill process 17
General 17
Dispencing pattern for ponents 18
9. PLACEMENT PROCESS SPECIFICATIONS 19
Nozzles 19
Feeders 19
NC-Programs 19
Part Data / Vision processing 20
Placement process management patibility table 20
SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT
General shipping and storage conditions
Expected shipping conditions (components and materials)
Relative humidity
RH 15 % - 70%
Temperature
-5°C...+40°C
NMP Storage conditions
Relative humidity
RH 15%-60%
Temperature
Temperature 25°C ± 5°C
Component pa