文档介绍：(burrs)7缺口/晕圈(nicks/haloing).(非导体)(Scratch)9凹坑(PitsandVoids)10露织物/显布纹(WeaveExposure/WeaveTexture) (Measiing/Crazing)11分层/起泡(Delamination/Blister)12夕卜来夹杂物(ForeignInclusions).2开路/.(AdhesionofOverplate)(不含阻焊膜)堵孔19PTH孔壁不良19PTH孔壁破洞19孔壁镀瘤/毛头(Nodules/Biirrs)21晕圈(Haloing)21粉红圈(PinkRing)22PTH孔与焊盘的对准(ExternalAnnularRing一SupportedHoles)22NPTH孔偏(ExternalAnnularRing一UnsupportedHoles)(Nonwetting)23焊盘缩锡(Dewetting)、、(CoverageOverConductors)(SkipCoverage)28阻焊膜气泡(Blisters/Delamination)(非塞孔的孔)29阻焊膜波浪/起皱/纹路(Waves/Wrinkles/Ripples)(SodaStrawing)3()-(LaminateVbids)(Delamination/Blister)34过蚀/欠蚀(Etchback)35金属层间的介质空距(DielecticMaterials,Clearance,MetalPlanes)36介质层厚度(Layer-to-LayerSpacing)(PlatingCrack…InternalFoil)(PlatingCrack)38表层导体厚度(SurfaceConductorThickness-FoilPhisPlating)39内层铜箔厚度(FoilThickness-InternalLayers)(AnnularRing-InternalLayers)39孔壁镀层破裂(PlatingCrack——Hole)40孔角镀层破裂(PlatingCrack——Corner)(基材渗铜)(Wicking)41独立通孔渗铜(Wicking,ClearanceHoles)42层间的分离(垂直切片)(InnerlayerSeparation VerticalMicrosection)42层间的分离(水平切片)(InnerlayerSeparation HorizontalMicrosection)43孔壁镀层空洞(PlatingVoids)(Resinfill)(Nailheading)(ThermalStress)46刚性PCB检验标准1