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第 31 卷第 6 期中国测试技术 Vol 31 No 6
2005 年 11 月 CHINA MEASUREMENT TECHNOLOGY Nov ,2005
超大规模集成电路测试和验证的发展趋势
VLSI2 2 2 2
贾建革, 段新安,李咏雪
(总后卫生部药品仪器检验所,北京 100071)
摘要:随着深亚微米级材料的应用,VLSI 器件进一步推动了半导体技术领域的发展,传统的测试和验证方法已不
能满足需要且成本较高,基于 Core 的系统级芯片要求芯片设计者必须改变以往的开发方式,以便缩短上市时间,扩
大销售额。一种嵌入式的测试方法应运而生,它能使芯片设计者在较短的时间内生产出高质量的产品,提高利润、
增加市场知名度,且大大减少了系统验证、检测和调试的时间。本文着重讨论嵌入测试技术,分析该技术对产品的
上市时间、产品质量以及生产成本所带来的影响。
关键词:嵌入测试;测试源;接收器;差错;大规模芯片
中图分类号:TN407 文献标识码:A 文章编号:1672 4984(2005) 06 0094 03
Emerging trends in VLSI test and diagnosis
J IAa Jian ge , DUAN Xin an , LI Yong xue
( Institute for Drug and Instrument Control of Health Dept GLD of PLA ,Beijing 100071 ,China)
Abstract :As the move to very deep submicron VLSI devices pushes the threshold of semiconductor technology , conventional test
and diagnosis methods e inadequate and costly The new level plexity driven by core based system chips demands that
designers alter the way they approach chip development in order to keep up with diminishing timeto market requirements and stay
within budgets Embedded test enables the production of high quality devices in less time The use of embedded test raises margins
and significantly reduces the required for system verification , test and debug This paper addresses discusses embedded test
technology and analyzes its impact on