一种雷达微波接收机电路的集成化设计与实现.pdf

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第 35 卷第 4 期微电子学 Vol 35 , №4
2005 年 8 月 Microelect ronics Aug 2005
文章编号:1004 3365 (2005) 04 0441 04
一种雷达微波接收机电路的集成化设计与实现
李佩, 陈兴国, 朱华顺
(中国电子科技集团公司第三十八研究所, 安徽合肥 230031)
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摘要: 文章叙述了实现雷达接收机立体微波集成电路的基板及焊接工艺,研制了一种针对多通
道雷达接收机的接收集成电路。提出了芯片电路设计,多层基板实现,以及芯片封装等实现方法。
测试结果表明,电路达到了预期的设计目标。该集成电路的实现,提高了雷达整机的集成化水平。
关键词: 雷达接收机; 单片微波集成电路; 多层基板; 微组装
中图分类号: TN432 文献标识码: A

Design and Implementation of an Integrated Microwave
Receiver for Radars
L I Pei , CH EN Xing guo , ZHU Hua shun
( East China Research Institute of Elect ronic Engineering , China Elect ronics Technology Group Corporation ,
Hef ei , A nhui 230031 , P. R. China)

Abstract : Substrate and soldering process to implement 3D microwave integrated circuits for radar receivers are
described , and an MMIC for a multi channel radar receiver is designed and implemented. Compared with the tradi
tional radar receiver , new approaches to multi layer substrate realization , chip design and chip packaging are pro
posed. The system in package (SIP) of microwave receiver was tested and anticipated results were achieved.
Key words : Radar receiver ; Monolithic microwave integrated circuit ; Multi layer substrate ; Microassembly
: 2570D

1 引言 2 微波电路集成技术
随着军事电子技术的飞速发展,武器装备的多为了提高微波电路的设计密度,新的技术主要
功能与小型化和可靠性要求越来越高。相控阵雷体现在材料及工艺上,微波集成电路选用的材料主
达,多通道接收机,雷