文档介绍：THE INSTITUTE FOR
INTERCONNECTING IPC-D-317A
AND PACKAGING
ELECTRONIC CIRCUITS
Design Guidelines
for Electronic Packaging
Utilizing High-Speed
Techniques
IPC-D-317A
January 1995 A standard developed by the Institute for Interconnecting
and Packaging Electronic Circuits
2215 Sanders Road Tel 847
Northbrook, Illinois Fax 847
60062-6135 URL:
The Principles of In May 1995 the IPC’s Technical Activities mittee adopted Prin-
Standardization ciples of Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
mended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liabilit