文档介绍：I PC技术标准目录之 电 子组装（Assembly）
2004-01-01 点击：5523
I PC技术标准目录之
电子组装（Assembly）
IPC-T-50F
Terms and Definition for Interconnecting and Packaging
Electronic Circuits
电子电路互连与封装的定义和术语
IPC-S-100
Standards and Specifications Manual
标准和详细说明汇编手册
IPC-E-500
IPC Electronic Document Collection
已出版的IPC标准电子文档资料合订本
IPC-TM-650
Test Methods Manual
试验方法手册
IPC-ESD-20-20
Association Standard for the Development of an ESD
Control Program
静电释放控制过程（由静电释放协会制定）
IPC/曰 AJ-STD-001C
Requirements for Soldered Electrical & Electronic
Assemblies
电气与电子组装件锡焊要求
IPC-HDBK-001
Handbook and Guide to Supplement
J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610C
Acceptability of Electronic Assemblies
印制板组装件验收条件
IPC-HDBK-610
Handbook and Guide to IPC-A-610 （Includes
IPC-A-610B to C Comparison
IPC-610手册和指南（包括IPC-A-61 OB和C的对比）
IPC-EA-100-K
Electronic Assembly Reference Set
电子组装成套手册，包括：IPC/EIA J-STD-001 C，
IPC-HDBK-001 IPC-A-61 OC。
IPC/WHMA-A-620
Requirements and Acceptance for Cable and Wire
Harness Assemblies
电缆和引线贴装的要求和验收
IPC/曰 AJ-STD-012
Implementation of Flip Chip and Chip Scale Technology 倒装芯片及芯片级封装技术的应用
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则
IPC/曰 AJ-STD-026
Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
J-STD-027
Mechanical Outline Standard for Flip Chip and Chip
Size Configurations
FC (倒装片)和CSP(芯片级封装)的外形轮廓标准
IPC/曰 AJ-STD-028
Performance Standard for Construction of Flip Chip and
Chip Scale Bumps
倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003
Chip Mounting Technology
芯片贴装技术
J-STD-013
Implementation of Ball Grid Array and Other High
Density Technology
球栅阵列(BGA)及其它高密度封装技术的应用
IPC-7095
Design and Assembly Process Implementation for
BGAs
球栅阵列的设计与组装过程的实施
IPC/曰 AJ-STD-032
Performance Standard for Ball Grid Array Balls
BGA球形凸点的标准规范
IT-98000
JPL Chip Scale Packaging Guidelines
JPL发布的CSP导则
注：IT (The California Institute of Technology)
JPL (The Jet Propu