文档介绍：TO 封装半导体激光器结构设计摘要 TO 封装技术, 其实就是指 Transistor Outline 或者 Through-hole 封装技术, 也就是全封闭式封装技术。是现在在应用中上比较常用的微电子器件的封装方式。 TO 封装的相对于其他的封装技术, 他的长处在于在于寄生参数比较小, 而且成本很低, 工艺也相对来说简单, 使用起来更加的灵活方便, 所以这种封装器经常用于低频率以下 LD, 还有 LED 以及光接收器件和组件的封装。而且其内部容量很小, 只有四根引线, 是不能安装半导体致冷器的。这些年来, 随着激光器阈值的降低, 对于许多的类似迎用, 例如短距离通信以及背板之间的连接,以致冷 TO 封装激光器获得了及其全面的应用。在封装成本上拥有着极大优势的由于 TO 封装, 以及人们对封装技术的大量研究,TO 封装激光器的速率已经高达 10Gb/s, 近年来高速 TO 形式封装激光器越来越受到人们的青睐。在 TO 封装半导体激光器中, 采用高热导率过渡热沉与热沉组合的结构, 可有效增强 TO 封装半导体激光器的散热特性, 尤其是采用双热沉结构, 更可将激光器芯片工作产生的热量通过 N 边和 P 边同时导向基座, 进而更为有效地增强 TO 封装的半导体激光器的散热能力,大幅度地去降低激光器有源区的节温,尽量减小激光器的热阻,从而延长半导体激光器的使用寿命。关键词: TO 封装,半导体激光器,光电子器件 The S tructure D esign of TO P ackaging t he S emiconductor L aser ABSTRACT TO packaging technology, is refers TO the Transistor Outline or Through - hole encapsulation technology, which is fully enclosed packaging technology. Is now in the application of microelectronic devices that are widely used in the packaging. TO encapsulate the relative TO other packaging technology, his 天津理工大学 2015 届本科毕业设计说明书 strength is that lies in the parasitic parameters are small, and the cost is low, technology is relatively simple, use rise more convenient, so this wrapper is often used for low frequency under the LD, and leds and the light receiving device ponent encapsulation. And its internal capacity is very small, only four lead, can't be installed semiconductor refrigerator. Over the years, with the reduction of laser threshold for many similar applications, such as the short munication and the connection between the back, with out cooling TO encapsulate laser and prehensive application. Has a great advantage in packaging costs due TO packaging, as well asa number of studies of encapsulation technology people, TO encapsulate laser rate is as high as 10 gb/s, in recent years high speed TO form enclosed laser more and more get the favour of people. In TO encapsulate semiconductor lasers, transitional heat sink with high heat conductivity and heat bination structure, which can ef