文档介绍：IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits
电子电路互连与封装的定义和术语  
IPC-S-100 Standards and Specifications Manual
标准和详细说明汇编手册
IPC-E-500 IPC Electronic Document Collection
已出版的IPC标准电子文档资料合订本
IPC-TM-650 Test Methods Manual
试验方法手册
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program
静电释放控制过程(由静电释放协会制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies
电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1
IPC-A-610C Acceptability of Electronic Assemblies
印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to parison
IPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set
电子组装成套手册,包括:IPC/EIA J-STD-001C,IPC-HDBK-001,IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology
倒装芯片及芯片级封装技术的应用
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
FC(倒装片)和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Ch