文档介绍：三、电子组装(Assembly)
IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语
IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册
IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本
IPC-TM-650 Test Methods Manual试验方法手册
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1
IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to parisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册,包括:IPC/EIA J-STD-001C,IPC-HDBK-001,IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC(倒装片)和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及