SOP封装工艺流程介绍.ppt

文档介绍：SOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL INSTRUCTION
第一页，共三十四页。
Contents
Package Instruction
Process Flow
Qualitg
damaged, contaminated and oxygenic.
第十四页，共三十四页。
Molding
Molding
Top chase
Air vent
Bottom chase
Cavity
Leadframe
Plunger
Pot
Gate insert
Runner
Compound
Bottom
cull block
Top
cull block
第十五页，共三十四页。
Molding
Molding
Top chase
Air vent
Bottom chase
Cavity
Leadframe
Pot
Gate insert
Runner
Compound
Bottom
cull block
Top
cull block
Plunger
第十六页，共三十四页。
Molding
Molding
Top chase
Air vent
Bottom chase
Cavity
Leadframe
Pot
Gate insert
Runner
Compound
Bottom
cull block
Top
cull block
Plunger
第十七页，共三十四页。
Molding
After Mold
Molding
Top chase
Air vent
Bottom chase
Cavity
Leadframe
Pot
Gate insert
Runner
Compound
Bottom
cull block
Top
cull block
Plunger
Epoxy
Lead Frame
第十八页，共三十四页。
Purpose：
Use laser light irradiated by CO2 or YAG to vapour the EMC to
show content on the package，such as date, schedule, place of
production and so on.
Laser Marking
laser
EMC vapoured
Before
After
Laser marking
第十九页，共三十四页。
Oven
Inside
Purpose:
To let EMC react completely so that products can be protected
more effectively.
Post mold cure
第二十页，共三十四页。
De-junk
Purpose：
Remove the dem-bar of leadframe.
Working area
Before
After
Laser Marking
Laser Marking
第二十一页，共三十四页。
Plating
Purpose:
To plating Sn on the lead which will mount on board pad.
load
unload
Plating line
第二十二页，共三十四页。
Plating
After
Before
投料區
電解去膠
高壓噴洗
酸洗
收料區
活化槽
電鍍槽
中和槽
熱D.
烘
乾
SOLDER PLATING (S/P 區)
ELECTRO DEFLASH (E/D區 )
面板操作
第二十三页，共三十四页。
Purpose:
Remove the tie-bar and lead-frame and form products to units from
strips, fill them into tubes and then pa