文档介绍：II
摘 要
电阻应变式测力称重传感器在各种高精度的机械测量中有广泛的应用，目前国内应用于高精度传感器的应变片基底材料的制备工艺相对落后，一定程度上阻碍了高精度传感器的发展。为满足传感器对高性能基底的使用要求，本课题研制了玻璃纤维（Gs of pure epoxy resin and epoxy film substrate with different reinforcement contents were investigated with Differential Scanning Calorimetry(DSC). Using the constant velocity to rise the temperature, curing curve of different DDS proportions can be obtained: When the quality of the DDS in the epoxy resin is 12%, The heat Han is the largest. Using DSC in the inconstant temperature to scanning epoxy resin mixed polysulfone, and curing temperature can be obtained by T-b extrapolation: gelation temperature was 90℃, curing temperature was 130℃, post cuing temperature was 160℃. To get the curing temperature of glass fiber(GF) and Mica reinforced epoxy resin composites by the same way: gelation temperature was 80℃, curing temperature was 130℃, post cuing temperature was 180℃.Under the different curing time, the DSC curves of different proportion shows: when gelation temperature kept 1h, curing temperature kept 2h, post cuing temperature kept 2h, epoxy resin film of different proportions can be cured completed.
Finally, the thermal properties, creep and the dynamic mechnical properties of epoxy film substrate with different reinforcement contents were tested with DSC and DMA, and the main performance parameters of the epoxy film substrate with different reinforcement contents was tested after the damp heat aging. The result showed that Tg of epoxy resin with different reinforcement contents were tested with DMA and DSC, similar Tg were obtained from these two methods. With the reinforcement adding to the epoxy film substrate, Tg was increased in some degree. The result showed that the Tg temperature of 10%GF and 10%Mica reinforced epoxy resin was the highest which increased 31℃. compared with the pure epoxy resin.
Under low temperature, creep of each substrate was quite small, with temperature increasing, the creep resistance of 30%GF reinforced epoxy h