倒装焊与芯片级封装技术的研究.ppt

文档介绍：倒裝焊与晶片級封裝技術的研究
Why Flip Chip?
Better manufacturing yield than wirebond for high pin-count chips.
對于高密度引腳芯片,成品率优于丝键合。
Faster manufacturing through-put than wirebond for high pin-count chips.
對于高密度引腳芯片,生产效率高于丝键合。
More reliability than wirebonded chips.
可靠性优于丝键合封装芯片。
Better electrical characteristics (less inductance) for high-speed chips. A must for RF, optoelectronics, high-speed digital (>500MHz).
对于高速芯片,具有良好的电学性能。
More on Why Flip Chip?
Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊点阵列封装需要倒装焊。
Desirable for Chip Size Package (CSP).
芯片尺寸封装技术需要倒装焊。
The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%.
倒装焊晶片市场预计年增长37%,而整体IC增长仅8%。
The Flipchip bonded wafer is expected to increase from million (2000) to million (2005) wafers.
倒装焊晶片预计由三百四十万片(2000年)增长至二千六百二十万片(2005年)。
Forecast on IC Unit IC产量预测(2000-2005)
Units (Billion)
Year
Source: Electronic Trend Publications Inc, 2001
Compound Annual Growth Rate: %
国最大的资料库下载
DQ Forecast Bare Die Usage(1999-2004)
(Units in Million)
Source: Dataquest, April 2001
Forecast on Bumped Wafers Usage凸点晶片使用预测(2000-2005)

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No. of Bumped Wafers
2005
2004
2003
2002
2001
2000
Year
Source: Dataquest, April 2001
(Units in Million)
Technology Leaders are Sold on Flip Chip倒装焊在技术领先企业中的应用
Intel has pletely