moldflow 改善产品变形问题.pdf

文档介绍：: .
Analysis purpose:
improve warpage
Analysis Project:
Cooling + flow + Warpage
Process setting
Mold Temperature:60/65℃
Melt Temperature: 220℃
Fill Time: automatic
Cooling time:60S
V/P switch-over: 99% of filled volume
pack
case1 case2
80%V/P 10S 80%++6X60%+12X100%S
2006-06-26 Reported: 4-28Part infomatiom
Thickness distribution
2006-06-26 Reported: 5-28Cooling system design
All case is base 2d mold design.
2006-06-26 Reported: 6-28Runner system design
case1 Ø12mm
Ø10~
Ø8mm
Ø~8mm
Ø10mm
Case1 is base 2d mold design ，
2006-06-26 Reported: 7-28Runner system design
Same case1
Same case1
Same case1 case2
Move gate
case2 is reviser runner system (move gate )
2006-06-26 Reported: 8-28Fill Time
case1
case2
The fill time result shows the position of the flow front at regular , as the cavity fills. Each color
contour represent the parts of the mold Which were being filled at same time.
.The fill time is about second in the model . No racetrack effect occur. Air trap a