文档介绍：该【各类封装配图 】是由【美梦成真Y】上传分享，文档一共【7】页，该文档可以免费在线阅读，需要了解更多关于【各类封装配图 】的内容，可以使用淘豆网的站内搜索功能，选择自己适合的文档，以下文字是截取该文章内的部分文字，如需要获得完整电子版，请下载此文档到您的设备，方便您编辑和打印。BGA
BallGridArray
EBGA680L
LBGA160L
PBGA217L
PlasticBall
GridArray
SBGA192L
TSBGA680L
CLCC
CNRCommunicationandNetworkingRiserSpecificationRevision
CPGACeramicPinGridArray
DIPDualInlinePackage
DIP-tabDualInlinePackagewithMetalHeatsink
FBGA
FDIP
FTO-220
FlatPack
HSOP-28
ITO-220
ITO-3P
JLCC
LCC
LDCC
LGA
LQFP
PCDIP
PGAPlasticPinGridArray
PLCC
PQFP
PSDIP
LQFP100L
METALQUAD100L
PQFP100L
QFPQuadFlatPackage
SOT143
SOT220
SOT223
SOT223
SOT23
SOT23/SOT323
SOT25/SOT353
SOT26/SOT363
SOT343
SOT523
SOT89
SOT89
Socket603Foster
LAMINATETCSP20LChipScalePackage
TO252
TO263/TO268
QFPQuadFlatPackage
TQFP100L
SBGA
SC-705L
SDIP
SIPSingleInlinePackage
SOSmallOutlinePackage
SOJ32L
SOJ
SOPEIAJTYPEII14L
SOT220
SSOP16L
TO247
SSOP
TO18
TO220
TO264
TO3
TO5
TO52
TO71
TO72
TO78
TO8
TO92
TO93
TO99
TSOPThinSmallOutlinePackage
TSSOPorTSOPIIThinShrinkOutlinePackage
uBGAMicroBallGridArray
uBGAMicroBallGridArray
ZIPZig-ZagInlinePackage
BQFP132
C-BendLead
CERQUADCeramicQuadFlatPack
CeramicCase
LAMINATECSP112LChipScalePackage
GullWingLeads
PDIP
PLCC
SNAPTK
SNAPTK