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电子器件封装(Electronic device package).docx

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文档介绍:该【电子器件封装(Electronic device package) 】是由【guoxiachuanyue006】上传分享,文档一共【15】页,该文档可以免费在线阅读,需要了解更多关于【电子器件封装(Electronic device package) 】的内容,可以使用淘豆网的站内搜索功能,选择自己适合的文档,以下文字是截取该文章内的部分文字,如需要获得完整电子版,请下载此文档到您的设备,方便您编辑和打印。电子器件封装(Electronicdevicepackage)
TalkaboutProtelDXP2008-09-2315:59componentlibrarytotheProtelDXPProtelDXPcomponentlibraryistheAltiumcompany(formerlyProtel)thelatestversionlaunchedin2002ofthecircuitandcircuitboardsoftwaredevelopmentplatform,itprovidesarichPCB(component)library,someproblemsbasedonthePCBlibrarytheuseofabriefdiscussion,andfriendstoshare.
:
PCBProtelDXPisrichinlibrary,unlikethepreviousversionis:ProtelDXPtheprinciplediagramofthelibrariesandPCBboardpackagelibrarywithadifferentextensionwithdistinction,,.PcbLibextensionPCBinthelibrarypackage,whichisinthesoftwareinstallationthepath"\Library\...":oneistheseparationofcomponentsofthepackage,isakindofintegratedcircuitcomponentsofthepackage,herewesimplyintroducerespectivelythemostbasicandmostcommonformofpackaging:
1,discretecomponentclass:
Capacitance:ordinarycapacitorcapacitanceandSMDcapacitors:,whichtypemoregeneralcanbedividedintotwocategories,oneisakindofelectrolyticcapacitorisnonpolaritycapacitor,electrolyticcapacitorduetothedifferentencapsulationcapacityandpressurearenotthesame,thenameoftheelectrolyticcapacitoris"RB.*/.*",whichissaid.*/.*padspacing/diameter,-polarcapacitoris"RAD-***",where
**representsthepadspacing,ininches.
Inthe\Library\PCB\ChipCapacitor-,thepackageismore,accordingtothedifferentcomponentsofdifferentpackages,thesepackagesaccordingtothepackagesizeprovidedbythemanufacturer,itisgenerallynamedCC****-****,which"-"behindthe"****"isdividedintotwoparts,thefirsttwo**isweldingthedistancebetweenthedisc,behindthetwo**padwidth,theunitis10mil,"-"infrontofthe"****"isthecorrespondingmetricdimensions.
Resistance:resistanceofordinaryresistorandchipresistor:,relativelysimple,itsnameis"AXIAL-***",whichrepresentsthe***padspacing,theunitisin.
,anditsnameis"R2012-0806"..
Diode:diodeordinarydiodeanddiodechip:,itsnameis"DIODE-***",whichrepresentsadata***,.
Transistor:,thename"itsnamewiththeProtel99SETO-***",inProtelDXP,thenameofthetriodeis"BCY-W3/***"series,canbeselectedaccordingtodifferentpowertransistor.
Connections:,whichcanbeselectedasneeded.
,andwearenolongerfamiliarwitheachdescription,butmustbefamiliarwiththenamingofeachcomponentsothatitisclearatthetimeofcall.
2,integratedcircuitclass:
DIP:isatraditionaldualinlinepackageic;
PLCC:;
PGA:anintegratedcircuitwithaconventionalgridarraypackage,
ThereisaspecialPGAlibrary;
QUAD:itisanintegratedcircuitofsquarepatchpackage,soitiseasytoweld;
SOP:anintegratedcircuitwithasmallSMDpackage,correspondingtotheDIPpackage;
SPGA:anintegratedcircuitthatispinarrayinpinarray;
BGA:anintegratedcircuitencapsulatedinasphericalgridarray;
Other:inaddition,therearesomenewpackaginganddeformationoftheabovepackage,herewillnolongerexplainonebyone.
Two,converttheProtel99SEcomponentlibrarytoProtelDXP:
IntheProtel99SEinsomepackageisnoProtelDXP,ifoneoftheseelementstocreate,notonlycumbersome,butalsomayhaveerrors,iftheintroductionofProtelDXPProtel99packagelibraryinSEisveryconvenient,andeffort,methodis:startProtel99SE,anew*.DDBpackagelibraryproject,inthisprojectintoneed,,justopenthesaved*.DDBfile,thenProtelDXPwillautomaticallyparseeachfileinthe*.DDBfile,andsavetheminthe"*"directory,,forProtel,99,,youcanalsoimportthepackagecomponentslibraryintoProtelDXP.
Three,createanewpackageelementinProtelDXP:
,:
:
Handpaintedpackageisakindofmethodofdrawingpackagingcomponents,weoftenusethemethodofdrawingandpackagingcomponentsinProtel99SEisbasicallythesame,wearefamiliarwith,herewehavethemostbasicdrawingmethodsandcommondrawingtoolsgiveyouabriefintroduction:
click*.PcbLib(createinthatcomponentlibrary,clickthatcomponentlibrary)anduse*.PcbLibasthecurrentlyeditedfile;
click[Tools]/[New,Component],closetheWizarddialogbox;
thereisadrawingtoolboxintheeditarea,asshowninthefollowingfigure:
Where:P1isthepadplacedtools,P2tools,P3isplacedviatextplacedtools,P4coordinatesforplacingtools,P5isthedimensionP6isplacedtools,tools,P7isplacedinlinearcplacedtools,P8isfilledwithtools,P9isplacedpastearrayconfigurationtool,herewebrieflyusethesetools:
,youcanmodifythepropertiesofthepad;
Clickonthe"P2"crossshapedmousetofollowthehole,clickwhereyouwantittobeplaced,andthendouble-clicktomodify
thepropertiesofthehole;
ClickontheP3glyph,themousefollowsthetext,clickwhereyouwanttoplace,double-clickthetext,setthetextandtextsizeinthedialogbox,andthelocationofthetext;
;
ClickonthemousetofollowtheP5crossthestartingsizeplacedinthestartingpositiononthesizeofinitialsize,andthenplacedtheendsizeontheendpositionoftheclick,double-clickthesizeandsizedimensionscanmodifythesizeofthelayer;
ClickontheP6lineinthestartingpositionclickstartplacinglines,thenmovethemousetoclicktoplacetheendpositionofthelineline,,double-:toplacelines,thelayersmustbeconvertedtothelayersthatneedtobeplaced;
,andmovethemousetochangetheshapeofthearcordrawanellipseorcircle;
ClickontheP8,followedbythepaddingofthemouse,whereyouwanttobeplaced,clickthestartposition,andclickattheendposition;
First,selectthecomponentsthatneedtobepastedintheeditarea,andcopythem,thenclickP9,,youcanalsoclickon[Place]/[Arc]andothermenustodraw,.
let'sdrawapackageelementtoseetheprocessofdrawingmanually:nowwe'redrawingamorphingintegratedcircuitelement,anditsoutlineisshowninthefollowingfigure:
Theshadowareainthemiddleisalargepad,mainlyforheatdissipation.
First,clickP1toputapadontheeditinterface,doubleclickthepad,changethenameofthepadto1,thepadshapeisRound,theYsizeis60mil,andtheXsizeis60mil.
Selectthepadandcopywiththemaintoolbarselectiontool.
ClickP9inthedialogboxtosetthenumberofarraypasteis6,theincrementis1,thedirectionofXincrementsof100mil,thedirectionofYincrementsof0isdetermined,incoordinates(0,0)Clickplacedarraypaste.
ThenumberoftheclickP9settingsinthedialogboxpastearrayis5,inincrementsof1,incrementalXdirectionis100mil,theincrementof0intheYdirectiondetermined,coordinates(50,60)intheclickplacedarraypaste,unselectalldeletedfirstplacedtheoriginalpad.
,modifythepadinthedialogboxshapeOctagonal,Ysizeis50mil,Xsizeis50mil,,,8to4,3to5,9to6,4to7,10to8,5to9,11to10,and6to11.
TheclickP6,converttoTopOverlaylayer(screenprintinglayer)inaccordancewiththesizeofdrawingtheshape,andthenthelinewidthofallchangesto2-.
OneclickP1inotherlocationsintheeditinginterfaceplaceapad,double-clickthepadinthedialogboxtomodifythepadsofXsize500mil,Ysize200mil,,wherethepadlayerisTopLayer(top).
ItwillbeconvertedtotheTopOverlaylayer(SiYinceng),clicktheP3placetext,double-clicktomodifythetext"TDIP11"toidentifytheleftmousebuttononthetextontothecenterpad.
Iclickonthe[Edit]/[SetReference]/[Pin1][Report]/[ComponentRuleCheck]executecomponentdesignrulescheck,accordingtothesizecharttoselecttheoptiontodetermine,iftheoutputreportisnoerror,thenthedesignissuccessful.
Clickthe"Rename..."Pressthebutton,changethecomponentname"TDIP11",andthepurposeofusingthepadwithoutfillingistopreventtheheatdissipationfrombecomingblockedduetosolderresistinthesolderbarrier.
ThesizeofthepackageelementstobedrawnfromtheEmustbeinlinewiththeactualcomponentsize,includingdimensions,padsizes,interplatesizes,pinholes,,whenwePCBcircuitboardproduction,therearemanycomponentsofthepackageinthelibraryisnot,forthemoreskilledengineers,theyarebasicallybyhanddrawingpackagespecial,,partofthepackageelementinthecomponentlibraryneedstobemodifiedinsomeareasormodifiedwiththeoriginalpackageelement,
Allneedtomanuallydrawandmodifythepackagecomponents.
2,createapackageelementwiththewizard:
Withthewizardtocreatepackagingcomponents,accordingtothedifferentcomponentsofthepackage,thestepsaredifferent,butthebasicmethodisroughlythesame,thefollowingwegivethemostbasicmethodofbriefintroduction:
Click*.PcbLib(createinthatcomponentlibrary,clickthatcomponentlibrary)anduse*.PcbLibasthecurrentlyeditedfile;
[click][Tools]/[NewComponent],inthedialogbox,selectthetypeofpackagereadytocreatecomponents,thefollowingtableistheformofeachpackagetypecomparisontable:
SerialnameDescription
1BallGridArrays(BGA)BGAtype
2,Capacitors,CAP,non-polarcapacitortype
3Diodesdiodetype
4Dualin-linePackage(DIP)DIPtype
5,Edge,Connectors,EC,edgelinkingtype
LeadlessChipCarier(LCC)LCCtype
PinGridArrays(PGA)OGAtype
QuadPacks(QUAD)GUADtype
Resistorstwopinelementtype
SmallOutlinePackage(SOP)SOPtype
11,Staggered,Ball,Gird,Arrayd(SBG)SBGtype
12,Staggered,Pin,Gird,Arrayd(SPGA)SPGAtype
SupposewechoosethepackagetypeofDualin-linePackage(DIP),andselecttheunitas"Imperial"(inEnglish,choosethe
Englishingeneral),andthenclick"Next"";
Third,istosetthepadsizeinthisdialog,ifwearetocreateaDIPpackagecomponents,youcanusethedefaultvalue,ofcourse,ifyouarenottypicaloftheDIPpackage,settingaccordingtothecurrentflowingthroughthepad,thepadelementlargecurrenttosetalittlebitbiggeraftersetting,clickNext";
Fourth,istosetuptheXandYdirectionspacingbetweenthepadsinthisdialog,ifwearetocreateaDIPpackagecomponents,youcanusethedefaultvalue,ofcourse,ifyouarenottypicaloftheDIPpackage,settingaccordingtothecurrentflowingthroughthepad,tosetupalittlebitbiggerthedistancebetweenthepadsofcomponentsinalargecurrent,setupaftertheclickNext";
Thescreenisset,thewidthofthelinescreenlayerinthisdialogbox,inordertomakeclearthebestscreenprintinglinewidthissetto2-5mil,thepopularsettingis5mil,andthenclicktheNextset";
Thenumberisset,thepadsinthisdialog,ifwearetocreateaDIPpackagecomponents,accordingtothepackageset;ifnotcreatetheDIPpackagecomponents,accordingtothenumberofsetpads,ofcourse,becauseitisgenerallyusedDIPpackagesetevenifset,andspecificpackagefrombehindwecanalsomodifytheset,clickonthe"Next";
Thename,issetforpackagingcomponentsinthisdialog,inthetextinputboxinput,inputafterclickNext";
S,intotheWizarddialogbox,click"Finish",butwearenotcreatingDIPcomponents,andtheremaybesomed