Pattern-1.doc

文档介绍：Subj: Auto Cu/Sn Plating Distribution and Throwing Power Test Report
Objective
From the prior testing result, we know the Auto Cu/Sn line has a poor plating distribution. According to the testing result, we have modified the copper plating tank 20#, adjusting the flight bar and V-block, adding a set floating shield and a set baffle near the top of the titanium baskets. We make this test to check present plating distribution and throwing power for different AR (aspect ratio).
Test Conditions
1) Test Boards
Panel Size: 18”x24” H/HOZ
Drilling Hole Size (2pnls): Ø, Ø, Ø, Ø
2) Copper Plating Solution
:
H2SO4:
Cl-: 40-80mg/l
PCM+: -
Temperature: 25±3℃
3) Plating Parameter
Auto Cu/Sn line tank 20#: flight bar B
DK=18ASF×80min
Mechanical Agitation: 20mm
4) Titanium Baskets
Size: 2″×6″×36″
Number: 8 titanium baskets per anode bar, arraying uniformly
5) Test Boards on Rack:
flight bar
solution level
18”
P1
P3
P5
P7
baffle
rack
18”
P2
P4
P6
P8
test board
24”
Measuring Apparatus
Fischer ISOCOPE¨MP30
Microscope
Measurement
Plating Distribution Measuring Points
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a/1
2
3
4
5
6
7
8
9
10
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b
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c
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d
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e
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f
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g
×100%
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h
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i

Throwing Powe