文档介绍：Subj: Auto Cu/Sn Plating Distribution Test Report (II)
Objective
From the first testing result, after modification the distribution of Auto Cu/Sn line is still not very well. According to the testing result, we modified the copper plating tank 20#. Raising the flight bar for 5mm, modifying the floating shield, moving away the baffle, adding a PP block at the bottom of the titanium baskets to raise the copper ball for 2 inch and rebuilding two long racks using copper material. We make this test to check present plating distribution.
Test Conditions
1) Test Boards
Panel Size: 18”x24” H/HOZ
2) Copper Plating Solution
:
H2SO4:
Cl-: 40-80mg/l
PCM+: -
Temperature: 25±3℃
3) Plating Parameter
Auto Cu/Sn line tank 20#: flight bar B
DK=18ASF×70min
Mechanical Agitation: 20mm
4) Titanium Baskets
Size: 2″×6″×36″
Number: 8 titanium baskets per anode bar, arraying uniformly
5) Test Boards on Rack:
flight bar
18”
P1
P3
P5
P7
solution level
rack
18”
P2
P4
P6
P8
test board
24” new racks
Measuring Apparatus
Fischer ISOCOPE®MP30
Measuring Points
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a/1
2
3
4
5
6
7
8
9
10
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b
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c
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d
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e
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f
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g
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h
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i
Data of Plating Distribution (unit: um)
Ave: average of plating th