文档介绍：FPC工艺流程培训
ZASTRON ELECTRONIC (SHENZHEN) COMPANY Ltd.
Department:PE/FPC Division
Agenda
FPC Advantages
FPC Structure
Production process
2
3D 立体构装与耐曲绕动态设计
(FPC could apply on 3D package & dynamic flexible design)
软板可依空间改变形状做立体配线构装
FPC allows three-dimension assembly & can fit variety outer case sizing.
软板具有高度曲绕、动态摆动之可行性
FPC has high flexibility and dynamic moving capability.
FPC Advantages
3
软板重量轻,体积薄,适合手持式携带型产品设计趋势
FPC make devices smaller ; thinner ; shorter & lighter.
轻、薄、短、小的高密度线路配布
(Light/Thin/Short/Small high density routing & assembly)
软板线路可符合高密度配布,最小线宽/线距1mil / 1mil (间隔 mm)
FPC could fit high routing density demands for 1/1 mil lines and spaces.( pitch mm )
FPC Advantages
4
软板可进行零件表面贴装与连接器互连,达到组装容易,维修便利,高信赖度
FPC can do the SMD and connector assembly easily and benefit for repair and high reliability.
卷式生产与良好的组装信赖度
(Roll to roll manufacturing and high assembly reliability)
软板生产方式可自动化连续性卷带式生产
Reel to reel continuous production is possible for FPC manufacturing.
FPC Advantages
5
FPC Structure
Copper Foil
Polyimide
Plating
Cover lay
单面板(Single Side)
使用单面板之基材于电路形成后,加上一层覆盖膜,成为一种最基本的软性电路板
Applied with single sided material to make pattern and cover the cover layer on it, that’s the simplest flexible boards.
6
FPC Structure
双面板(Double Side)
Cover lay
Copper Foil
Polyimide
Plating
使用双面板之基材,于双面电路成形后,分別在各面加上一层覆盖膜,成为另一种基本电路板
Applied with do