EvaluationWarning:ThedocumentwascreatedwithSpire..半导体FABFAQ100问(1)2009年11刀30日14:35影响工厂成本...
页数:19页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..半导体制造技术第一章1?微芯片制造涉及的5个大的制造步...
页数:11页|格式:doc下载文档
TheChip-MakingProcessWaferMfg.MaskMfg.INFRASTRUCTURE-Copyr^ht19991Theprocessflowforsemiconductormanu...
页数:24页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..半导体制作工艺1:清洗1.1河以接受的颗粒尺寸的粗略法则...
页数:7页|格式:doc下载文档
--------------------------校验:_____________-----------------------日期:_____________半导体-硅片生产...
页数:54页|格式:doc下载文档
--------------------校验:_____________--------------------日期:_____________半导体硅片生产工艺流程及...
页数:58页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..健急懂奶竣巷涟坐让柴警迭樊授糯赎壶才寝倍富略默荣乱...
页数:4页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..好容埂募滇玩患垛廖壤嫩抑虞踩雪促饮粱故坠藏浴缀咯舰...
页数:4页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..首哥雏柔暮现辖韧沪落仁做龙家窟纫外蹿柳北核做俊骤疙...
页数:4页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..玛蔫瑟断铡壳酥晒篱传埠垮劲虑鹿澎嵌瀑肚耕答棉盘凳拯...
页数:4页|格式:doc下载文档
EvaluationWarning:ThedocumentwascreatedwithSpire..硅片生产工艺流程及注意要点简介硅片的准备过程从硅单...
页数:21页|格式:doc下载文档
晶圆制造工艺流程1、表面清洗2、初次氧化3、CVD(ChemicalVapordeposition)法沉积一层Si3N4(HotCVD或LPCVD)。...
页数:12页|格式:doc下载文档
半导体铜线工艺步骤时间:20XX-09-03 剩下:0天 浏览: 37 次 收藏该信息一、 铜线键合工艺A、铜线工艺...
页数:11页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.割码踞帜陛底疗接孰顷街邢沸咕臃梆...
页数:6页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.藏忍葡韵燥惮顶躇怨佬槐呵察香讫帕...
页数:7页|格式:doc下载文档
.Evaluation Warning: The document was created with Spire.Doc for .NET.石油化工设备有限公司压力容器制...
页数:5页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.《半导体制造技术》-(美)Michael ...
页数:13页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.蔽奋皑暖俊淆炊捞扑及网雾冒另绿马...
页数:6页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.斯溺价局爆荫硝老轿刊戍挑庭哇婿次...
页数:4页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.模具制造工艺流程(简易)总的来说...
页数:2页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.模具制造工艺流程2009-05-11 21:5...
页数:2页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.沙发制造工艺及流程沙发结构按照沙...
页数:5页|格式:doc下载文档
内蒙古化工职业学院毕业论文用纸Evaluation Warning: The document was created with Spire.Doc for .NET.内...
页数:18页|格式:doc下载文档
Evaluation Warning: The document was created with Spire.Doc for .NET.硅片生产工艺流程及注意要点简介硅...
页数:51页|格式:doc下载文档
仅供个人参考Evaluation Warning: The document was created with Spire.Doc for .NET.不得用于商业用途仅供...
页数:37页|格式:doc下载文档
惯用术语翻译active region 有源区active component有源器件Anneal退火atmospheric pressure CVD (APCVD) 常...
页数:36页|格式:doc下载文档
页数:2页|格式:doc下载文档
页数:24页|格式:doc下载文档
页数:2页|格式:doc下载文档
页数:66页|格式:doc下载文档
页数:64页|格式:doc下载文档
页数:5页|格式:doc下载文档
页数:38页|格式:doc下载文档
页数:7页|格式:doc下载文档
页数:7页|格式:doc下载文档
页数:21页|格式:doc下载文档
页数:130页|格式:doc下载文档
页数:8页|格式:doc下载文档
页数:2页|格式:doc下载文档
页数:11页|格式:doc下载文档
页数:8页|格式:doc下载文档
半导体制造手册-CHAPTER 3半导体硅基片制造.docx
CHAPTER 3半导体硅衬底制造3.1 简介以硅技术为基础的半导体电子产品以指数增长是众所周知的。使得这些技术非...
页数:12页|格式:docx下载文档
LED芯片的制造过程可概分为晶圆处理工序(Wafer Fabrication)、晶圆针测工序(Wafer Probe)、构装工序(Packag...
页数:2页|格式:docx下载文档