文档介绍：,.JDLIRNAL OF THE ELECTROCHEMICAL SOCIETY
ACCs163
~'~ L JANUARY
MUNICATIONS ,
~,,.~j/ 1978
puter Study of pH Effect in Electroless Copper Deposition
Milan Paunovic":',1
en Corporation, Photocircuits Division, Glen Cove, New York 11542
It was found by Schoenberg (I) bM=RT/~ M n M F, bRed=RT/aRednRed F
that the rate of electroless deposi-
tion of copper first increases, passes and the rate of deposition ide p
through a maximum and then decreases
when the concentration of formalde- idep = (i~) p ( d) q exp (V) [5]
hyde, copper ions and plexing
agent are held constant and that of where V=[(ERM-ERRed)/(bM+bRed)] [6]
sodium hydroxide varied. The maximum
rate and the falling off of the rate P=bM/(bM+bRed), q=bRed/(bM+bRe d)
at high pH values was explained (i)
on the basis of dissociation of methy- and the meaning of other symbols are
.o
lene glycol and the change of the as follows: l~, iRed, ERM, and ERRed
relative concentration of the methylene are the exchange current densities and
glycolate and the hydroxide ions with the rest (equilibrium) potentials for
pH. In order to contribute to the the cathodic and anodic partial react-
interpretation of this pH effect we ions, respectively.
have derived series of mathematical
models of electroless copper deposition munication discusses only
and puter solutions for the two m