文档介绍：First Edition, 2011
ISBN 978-93-81157-19-0
© All rights reserved.
Published by:
The English Press
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Delhi - 110002
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Table of Contents
Chapter 1- Failure Modes of Electronics
Chapter 2 - Electromigration
Chapter 3 - Electrostatic discharge, Overvoltage & Overcurrent
Chapter 4 - Semiconductor-Related Failures
Chapter 5 - Stress-Related Failures
Chapter 6 - Optoelectronics Failures
Chapter 7 - Microelectromechanical Systems Failures
Chapter 8 - Vacuum Tubes Failures
Chapter- 1
Failure Modes of Electronics
Electronic devices have a wide range of failure modes. These can be distinguished by
their development in time (sudden failure or gradual degradation), by environmental
effects (. corrosion, ionizing radiation) or by the electrical parameter which was
exceeded (. electrostatic discharge, overvoltage, overcurrent, etc.).
Failures monly occur at the beginning and near the end of the lifetime of the
parts. Burn-in procedures are used to detect early failures.
Presence of parasitic structures, irrelevant for normal operation, may e important
in the context of failures; such structures can be both a source of failure and a protective
device.
A sudden fail-open failure can cause multiple secondary failures, when the event is fast
and the circuit contains an inductance. The suddenly interrupted current flow in
combination with the inductance then causes large voltage spikes, which for very fast
events may exceed 500 volts. A burned metallization on a chip may then cause secondary
overvoltage damage.
Packaging-related failures
Electronic packaging, acting as the barrier between the materials of the electronic parts
and the environment, is very susceptible to environmental factors. Thermal c