003 双面板及多层板pcb工艺流程图.pdf

文档介绍：工艺流程
Production process

双面板多层板
Double-sided Mulitlayer

开料内层开料
Sheets Cutting I/L cutting

钻孔干/湿膜内层线路
Dirlling I/L Dry/Wet film

去毛剌内层曝光/显影
De-Derurr I/L Exposure/Develop

化学沉铜内层蚀刻
I/L Etching

整板电镀去膜
Panel plating Stripping

干膜线路线路检测
Dry film Trace check/AOI

曝光/显影冲定位孔
Exposal/Develop Target hole punching

蚀刻(表面处理) 黑氧化处理
Etching (Surface process) I/L Black oxide

去膜成型定位、叠层、压合
Stripping Profile Lamination

中检/测试 V-割钻靶孔
Midd check/test V-CUT Target hole drilling

阻焊印刷最终清洗钻孔
Solder resist Final clean Drilling

预烤电测去毛剌
Precure E-Test De-Derurr

曝光/显影除胶渣
Exposure/Develop (O S P) Desmear

文字印刷
Silkscreen FQC/FQA

终烤包装/出货
Postcure Packing/Shipping