文档介绍：研究实例之五
游离金属ASV测定过程中络合物解离模拟
络合容量
络和容量(游离金属)测定
天然水的络和容量
游离金属测定
阳极溶出伏安法
其他方法
选择性电极
阳极溶出测定误差
解释2:动力学解离
解释1:电极非惰性络合物
测定误差:高估游离金属
测定结果与富集时间的关系
20
16
12
8
4
0
0
4
8
12
16
20
Measured free copper (umol/L)
Deposition time (s)
Total copper = umol/L
Calculated free copper = umol/L
[EDTA] = umol/L
18
12
6
0
0
4
8
12
16
20
Measured free copper (umol/L)
Deposition time (s)
Total copper = umol/L
[FA] = 200 mgC/L
24
滞膜模型(单膜)
Cw
水相
距离
浓度
释放
沉积物
滞膜层
Cw’
Cs
络合物解离概念模型
Electrode
Bulk Solution
Stagnate Film
ML
L
+
M+
migration of ML
migration of L
conc profile of free metal
migration of M+
模拟进程
Electrode
Bulk Solution
ML
Lf
M+
Electrode
Bulk Solution
ML
Lf
M+
Electrode
Bulk Solution
Stagnate Film
ML
Lf
M+
模拟结果
Concentration
[M+]
Concentration
[M+]
Concentration
[M+]
[M+]
Without Ligand
With Ligand
[ L ]
[ML]
[ L ]
[M+]
[ML]
[ L ]
[M+]
[ML]
步长影响
Flux
Time
step = 6
step = 9
step = 30
step = 60
step = 180
step = 120
Final Flux
Number of steps
- step
Flux = e +
step = 120