文档介绍：JOINTINDUSTRYSTANDARDRequirements forSoldered Electricaland ElectronicAssemblies3rd Interim FinalJ–STD-001BOCTOBER 1996Revision A January 1995Original Publication April 1992Document Relationship J-STD-001/IPC-A-610/IPC-CM-770/IPC-D-325Document Purpose Spec. # De?nitionDesign Standard IPC-D-275 Design requirements re?ecting 3 levels plexity(Levels A, B, and C) indicating ?ner geometries, greaterdensities, more process steps to produce the -CM-ponent and Assembly Process Guidelines to assist inthe design of the bare board and the assembly where thebare board processes concentrate on land patterns forsurface mount and the assembly concentrates on surfacemount and through-hole principles which are usuallyincorporated into the design process and ItemDocumentationIPC-D-325 Documentation depicting bare board speci?c end-productrequirements designed by the customer or end itemassembly requirements. Details may or may not referenceindustry speci?cations or workmanship standards as wellas customers own preferences or internal Item Standards J-STD-001 Final product requirements for printed boards or ?nalrequirements for printed board assemblies depictingminimum end-product acceptable characteristics, as wellas methods for evaluation (test methods), frequency oftesting and applicable ability of process Standard IPC-A-610 Pictorial interpretative document indicating variouscharacteristics of the board and/or assembly asappropriate relating to desirable conditions that exceedthe minimum acceptable characteristics indicated by theend- item performance standard and re?ect variousout-of-control (nonconforming) conditions to assist theshop process evaluators in judging need for Program TBD Documented training requirements for teaching andlearning process procedures and techniques forimplementing acceptance requirements of either end-itemstandards, workmanship standards,