文档介绍：摘要
用非等温DSC对环氧树脂在动态升温过程中的固化动力学进行了研究,采用Kissinger方程对固化动力学模型参数中固化反应活化能、反应级数和指前因子进行了计算,并用Ozawa法对固化反应活化能进行了验证,计算结果表明,环氧树脂/磺酰胺固化反应符合n阶固化动力学模型,结合不同升温速率下的特征温度,对环氧树脂的固化条件进行了优化。
环氧树脂的固化反应主要发生在环氧基团上。在环氧树脂固化过程中,树脂分子在固化剂或促进剂的作用下分子链增长、支化和交联,分子量不断增大,最终形成三维网络结构。树脂的交联程度(固化效果)直接决定着材料的性能,因此,对某一固定的树脂和固化剂体系,如何选取最佳固化工艺条件以获得具有最佳性能的材料尤为重要。热分析法是研究树脂固化过程的最重要的手段之一,通过测定固化过程中的热效应,建立固化动力学模型,在理论上预测固化反应的进程。并可通过动力学因子的计算,进一步优化固化工艺。
关键词:环氧树脂;DSC;非等温固化
Abstract
Using non-isothermal DSC dynamic heating process of epoxy resin in the curing ics were studied,Kissinger equation using the model parameters in the curing ics of curing reaction activation energy, reaction order and preexponential factor were calculated,and Ozawa method using the activation energy of curing reaction was verified,the results show that, EP / DDS curing curing reaction consistent with n-order ic model, with different heating rates characteristic temperature of epoxy resin curing conditions were optimized。
Epoxy curing reaction mainly occurs in the epoxy group. Curing process in epoxy resin curing agents or molecules under the influence of accelerator chain growth, branching and crosslinking, molecular weight is increasing, and eventually the formation of three-work structure. Degree of resin cross-linking (curing effect) directly determines the properties of the materials, therefore, a fixed resin and curing agent system, how to select the best conditions for curing process to get the best performance of the material is particularly important. Thermal analysis is the process of curing one of the most important means, by measuring the thermal effect of the curing process, the establishment of curing ics model, in theory, the process of curing reaction prediction. Can be calculated by ic factors, and further optimize the curing process.
Key words: epoxy resin; DSC; non-isothermal curing
目录
第一章概论 1
关于环氧树脂 1
环氧树脂定义 1
环氧树脂行业 1
环氧树脂固化机理 2
3
3
咪唑类固化剂的反应机理 4
1.