文档介绍：Ni元素对Sn-Cu无铅焊料性能的影响
摘要
随着科学技术的迅猛发展,人类对于经济效益和生态环保的要求不断增强,由于传统的锡铅焊料会对环境和人类身体健康造成危害,所以在电子封装产业中无铅焊料的发展势在必行,Sn-Cu系无铅焊料不仅成本低廉,而且综合性能良好,成为传统锡铅焊料的优良替代品,有着很大的研究价值和发展潜力。
本文旨在研究添加不同Ni元素对Sn-Cu系无铅焊料性能的影响,在Sn-,设计焊料合金成分配比,熔炼试样,制备金相试样,并进行金相组织观察和性能测试,包括显微硬度、熔化特性以及XRD物相分析和电子探针成分分析。通过分析以上实验结果探究不同Ni元素的添加对Sn-Cu系无铅焊料显微组织、硬度、熔化特性等的影响,得到结论如下:
(1)、Sn-,产生的()6Sn5可以成功地抑制Sn-Cu系无铅焊料中Cu6Sn5金属间化合物中的龟裂,使得组织更加均匀。
(2)、Sn-,组织形貌发生了明显的变化。组织中的()6Sn5相随着Ni元素含量的增多,逐渐增大且均匀化。
(3)、Sn-,焊料合金熔点略有上升,但是熔程较小,有利于焊接;焊料合硬度先下降再升高,其中Sn--。
关键词:无铅焊料,Sn-,显微硬度,焊接性能
Abstract
The economic and environmental awareness of human beings is growing with the rapid development of science and technology. the traditional tin-lead solder is harm to environment and our health, So lead-free solder is imperative in the electronics packaging industry. Sn-Cu lead-free solder is not only inexpensive, but also has good properties which may act as an alternative to traditional tin-lead research has great meaning and development value.
This paper aims to study the influence on different Ni to Sn-Cu lead-free solder. We add different content of Ni element to Sn- lead-free solder , by the designing position of the solder , using the melting metallographic technology to make the metallographic sample. Then, observe the microstructure and properties of the sample. These properties including micro-hardness, melting addition,we should carry on the XRD phase analysis and electron probe microanalysis. By analyzing the results of the above experiment to recognize the influence on different Ni to Sn-Cu lead-free solder. Including the microstructure, hardness, melting characteristics of the Sn-Cu lead-free solder. The conclusions are as follow:
、The emerge of ()6Sn5 by adding Ni to Sn- alloy reduced the split of the Cu6Sn5 which anization more pure.
、The microstructure has significant changes by adding Ni