文档介绍：The Institute for
Interconnecting IPC-4101
and Packaging
Electronic Circuits
Specification for Base
Materials for Rigid and
Multilayer Printed Boards
IPC-4101 A standard developed by the Institute for Interconnecting
December 1997 and Packaging Electronic Circuits
Supercedes 2215 Sanders Road Tel 847
IPC-L-108, IPC-L-109, Northbrook, Illinois Fax 847
IPC-L-112, IPC-L-115 60062-6135 URL:
IPC-AM-361
Standardization In May 1995 the IPC’s Technical Activities mittee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
mended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such acti