文档介绍：WEMPEC
PCB Design for
EMI/pliance
Eric Benedict
WEMPEC Seminar
21 July 2000
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WEMPEC
References
Unless noted otherwise, everything is from the 1st two references
PCB Design Techniques for EMC and Signal Integrity Short Course, 27-29
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June, UW–Madison, Mark Montrose, Instructor
Printed Circuit Board Design Techniques for pliance, Mark Mon-
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trose, 1996 IEEE Press
Electronic Manufacturing, Sheldon Kohen and Michael Rose, 1982 Reston
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pany
Linear Design Seminar, Analog Devices, October 1987
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Electronic Manufacturing Processes, Thomas Landers, William Brown, Earnest
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Fant, Eric Malstrom and Neil Schmitt, 1994 Prentice Hall
Electronics Assembly Handbook, Keith Brindly, 1990 Newnes
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WEMPEC
Presentation Overview
Definitions
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PC Board Materials & Construction
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EMC Fundamentals
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EMI Suppression
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Signal Integrity
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Bypassing & Decoupling
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Trace Routing
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ESD Protection
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WEMPEC
Definitions
Printed Circuit Board (PCB) Also known as a Printed Wire Board (PWB).
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A device used to mechanically ponents while providing electrical
interconnection via a transmission line. It consists of one or more layers of
an insulating material and one or more layers of a conductive foil.
land The part of a PCB trace allocated for the connection to ponent.
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via A hole in the PCB with conductive plating on the inside and which con-
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nects to one or more condutive layers.
Through-hole Technology (THT) “Standard” ponents which are
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mounted by inserting the leads into vias and then filling the vias and sur-
rounding land/pad with solder.
Surface-mount Technology (SMT) ponents which are soldered
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directly onto the lands located on the surface of the PCB.
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WEMPEC
patibility (EMC) The capability of electical and elec-
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tronic systems, equipment, and devices to operate in their intended electro-
ic environment within a defined margin of safety, and at design levels
of