文档介绍：./文件编号:FIPEI-KCR-053REV./版本号:01PRODUCT/产品:KyoceraTITLE/标题:LeadFreeBGA_Reballing_Process_无铅BGA植球工艺流程PAGE/页数1of11REVISIONHISTORY/版本记录REVISION版本CHANGEDESCRIPTION修改内容ISSUER发布者RELEASEDATE发行日期01FirstIssueRobertxiaREMARK备注ReleaseonehardcopytoMBU/-001-:ThisprocdureprovidesinstructionforleadfreeBGAreballingprocess..:::(FLX-400454-00)/烙铁嘴型号:(FLX-400454-00)(Type:CT-400A)/微型超声波清洗机(型号:CT-400A)(MSM6100)//-200ARe-flowoven/SUNEASTTRF-/:IPA(FLX-1001100-00)/清洗液:工业酒精(FLX-1001100-00):(FLX-400412-00)/免洗吸锡线:(FLX-400412-00)(:3:05)/Indium58LS锡膏(:3:05)//.7Reflowovencarrier(stainlesssteel)//(::)/ACCURUSSCIENTIFIC锡球(::):1)plianlybeforereballing2)onlyonekindofmaterialscanbeputontheproductionlickatsametime./植球前确认所有物料和工具适用无铅,2)同一时间只能有一种物料生产。processflow/InspectionInspection&TestingBGARemovalPadClean(solder/fluxresidue)Bake(125C/4hrs)ReflowBallFillingSolderpasteprintingCleaning/Baking*DryPacking*Appendices/附录AppendixA:cleaningpackagewithsolderingiron./附录A:,,