文档介绍：苏州大学
硕士学位论文
面向某半导体企业的芯片引脚检测系统的设计与实现
姓名:汤晓燕
申请学位级别:硕士
专业:计算机技术
指导教师:姜晓峰
2010-11
面向某半导体企业的芯片引脚检测系统的设计与实现中文摘要
面向某半导体企业的芯片引脚检测系统的
设计与实现
中文摘要
视觉检测在工业检测中已经得到了广泛的应用。本文主要研究了某企业半导体后
道封装中剪切成型机的视觉检测系统,结合检测过程中的实际需求及遇到的困难,利
用机器视觉的优点,应用数字图像处理学理论和方法,对系统总体设计、结构及关键
技术的实现等展开了研究,设计和实现了一套用于剪切成型制程中的芯片引脚检测系
统。
论文主要研究内容如下:
1. 针对检测中芯片的识别与定位问题,采用梯形分层搜索的序贯相关判决算法
的匹配策略,在执行时间增加很小的情况下显著提高了精度。通过实例表明,该算法
很好地实现了目标图像的识别与定位,保证了后续各项检测的实时性、准确性与可靠
性。
2. 对于芯片的引脚检测问题,使用 LoG 边缘算子提取图像的边缘信息,结合直
线的最小二乘拟合法检测芯片的边缘;利用边缘信息取得引脚的各项尺寸,将引脚的
常见缺陷量化为对引脚个数、相邻引脚间距值的计算判断,结合边缘的灰度变化,判
断引脚外观的优劣。该方法可以很好地检测出芯片引脚的常见缺陷。
论文课题所研发的系统能检测芯片外观的各类主要缺陷,满足该企业用户的实际
需求。同时,系统本身也是对视觉检测和数字图像处理相关理论和算法的应用和验证。
因此,本文的研究工作具有综合的理论和实践价值。

关键词:芯片检测,机器视觉,模板匹配,边缘检测
作者:汤晓燕
指导教师:姜晓峰
Abstract Design and Implement of IC Leads Inspection System For a Semiconductor Enterprise

Design and Implement of IC Leads Inspection System
For a Semiconductor Enterprise
Abstract
Vision inspection, as a promoting technology, has been applied widely in industrical
area. This dissertation focuses on the inspection problems in Trim/Formming process in
semiconductor BOL(Back of line) assembly. To solve these problems, an IC appearance
inspection system is designed and developed by machine vision with digital image theory
and method. An extensive study on system design, architecture and implement in crucial
technologies is carried out. The main research as follows:
1. Aimed at the problems of the ICs recognize and locate, a match strategy,
sequential decision algorithm, is raised. Inspection accuracy is improved dramatically as
well as just a little more time is needed. Applications show that the target image is
effectively recognized and located and the proposed method is stable and essful.
2. ing to the IC leads inspection, LOG mask is convoluted with the
polyline method to detect the edge. According to lead edge information, the dimensions of
leads, such as lead count, pitch width, a