POSS颗粒对Sn基无铅钎料晶须生长的影响.doc

文档介绍：
POSS 颗粒对 Sn 基无铅钎料晶须生长的影
响#
刘思涵,马立民,舒雨田,左勇,郭福**
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(北京工业大学材料科学与工程学院,北京 100124)
摘要:在电子产品高速微型化的发展趋势下,晶须作为封装产品中不可避免的可靠性问题已
受到越来越多的关注。而在全球无铅化的推动下,无铅钎料焊点中晶须的抑制正亟待解决。
已有研究表明,一种有机-无机笼形硅氧烷齐聚物 Polyhedral Oligomeric Silsesquioxane (POSS)
可有效提升 Sn 基无铅钎料包括剪切强度、显微硬度、电迁移和热疲劳抗力在内的综合性能。
鉴于此,本文采用回流焊工艺,研究了 POSS 增强颗粒对 Sn 基无铅钎料晶须生长行为的影
响。实验结果表明,POSS 在等温老化条件下通过减缓金属原子的扩散而抑制了金属间化
合物生长。根据先前的研究,金属间化合物生长过程中引起的压应力是晶须形成的主要驱
动力。因此,POSS 的添加可有效抑制 Sn 基无铅钎料在等温老化下的晶须生长。
关键词:Sn 基无铅钎料;晶须;POSS
Effects of POSS Addition on Whisker Formation in
Sn-Based Pb-Free Electronic Solders
Liu Sihan, Ma Limin, Shu Yutian, Zuo Yong, Guo Fu
(Materials Science and Engineering School, Beijing University of Technology, Beijing 100124)
Abstract: As an unavoidable reliability issue in electronic packages, whisker has attracted more
and more attention under the fast development in electronic products miniaturation. With the trend
of lead-free material application, whisker inhibition in lead-free solders should be solved urgently.
Previous studies have proofed that anic-anic hybrid material, Polyhedral Oligomeric
Silsesquioxane (POSS), could improve prehensive properties of Sn-based lead-free solders,
such as the shear strengh, microhardness, the resistance to electromigration or thermal fatigue. In
this study, the reflow process was utilized to investigate the effects of POSS addti