文档介绍：ponent印制元件printedcontact印制接点printedboardassembly印制板装配board板rigidprintedboard刚性印制板flexibleprintedcircuit挠性印制电路flexibleprintedwiring挠性印制线路flushprintedboard齐平印制板metalcoreprintedboard金属芯印制板metalbaseprintedboard金属基印制板mulit-wiringprintedboard多重布线卬制板moldedcircuitboard模塑电路板discretewiringboard散线印制板microwireboard微线印制板buile-upprintedboard积层印制板surfacelaminarcircuit表面层合电路板B2itprintedboard埋入凸块连卬制板chiponboard载芯片板buriedresistanceboard埋电阻板motherboard母板daughterboard子板backplane背板bareboard裸板copper-invar-copperboard键盘板夹心板dynamicflexboard动态挠性板staticflexboard静态挠性板break-awayplanel可断拼板cable电缆flexibleflatcable(FFC)挠性扁平电缆membraneswitch薄膜开关hybridcircuit混合电路thickfilm厚膜thickfilmcircuit厚膜电路thinf订m薄膜thinfilmhybridcircuit薄膜混合电路interconnection互连conductortraceline导线flushconductor齐平导线transmissionline传输线crossover跨交edge-porientside元件面solderside焊接面printing印制grid网格pattern图形conductivepattern导电图形non-conductivepattern非导电图形legend字符markbasematerial基材laminate层压板metal-cladbadematerial覆金属箔基材copper-L)positelaminate复合层压板thinlaminate薄层压板basismaterial基体材料prepreg预浸材料bondingsheet粘结片preimpregnatedbondingsheer预浸粘结片epoxyglasssubstrate环氧玻璃基板masslaminationpanel预制内层覆箔板corematerial内层芯板bondinglayer粘结层filmadhesive粘结膜unsupportedadhesivefilm无支撑胶粘剂膜coverlayer(coverlay)覆盖层stiffenermaterial增强板材copper-cladsurface铜箔面foilremovalsurface去铜箔面uncladlaminatesurface层压板面basefilmsurface基膜面adhesivefaec胶粘剂面platefinish原始光洁面mattfinish粗面lengthwisedirection纵向crosswisedirection模向cuttosizepanel剪切板ultrathinlaminate超薄型层压板A-stageresinA阶树脂B-stageresinB阶树脂C-stageresinC阶树脂epoxyresin环氧树脂phenolicresin酚醛树脂polyesterresin聚酯树脂polyimideresin聚酰亚***树脂bismaleimide-triazineresin双马來酰亚***三嗪树脂acrylicresin丙烯酸树脂melamineformaldehyderesin三聚氧***甲醛树脂polyfunctionalepoxyresin多官能环氧树脂brominatedepoxyresin澳化环氧树脂epoxynovolac环氧酚醛fluroresin***树脂siliconeresin硅树脂silane硅烷polymer聚合物amorphouspolymer无定形聚合物crystallinepolamer结晶现象dimorphism双晶现象copolymer共聚物synthetic合成树脂thermosettingresin热固性树脂thermoplasticresin热塑性树脂photosensitiveresin感光性树脂epoxyvalue环氧值dicyandiamide双氤***binder粘结剂adesive胶粘剂curingagent固化剂flam