文档介绍：BasicofSolderPasteandSMTImplementationProcess焊锡膏基础知识和SMT应用工艺FredKeTechnicalserviceAssistantManagerEunowElectronicMaterials(Suzhou)Co.,Ltd(0086)-512-66076290Ext:******@SolderPasteandSMTImplementationProcess焊锡膏基础知识和SMT应用工艺BasicofSolderPaste////SMT常见问閑题阩的处理Section1:FundamentalsofSoldering第一章节:/•Solderisanalloyof2ormoremetals/通常焊料頔是由两种或两种以上的金属合金组成的•Solderingisaprocessthatjoinstwometallicsurfaces/锡焊实际闄是两种金属的表面形成有效頒连接的过程•Temperaturestypicallybelow600°F(316°C)/温度通常低于华氏600度(摄氏316度)TypicalMetalsUsedinSolderAlloys通常焊料頔合金使用的金属•Tin(Sn)/锡•Lead(Pb)/铅•Silver(Ag)/银•Copper(Cu)/铜•Bismuth(Bi)/铋•Indium(In)/铟•Antimony(Sb)/锑•Zinc(Zn)/position/合金成分•binations./大多数不同的元素可以组成无限数量的化合物•binationwillhaveitsownphysicalproperties./monPhysicalPropertiesusedtodistinguishsoldersare:/通常用于区分焊料頔的物理特顠有:–MeltingPoint/熔軙点–TensileStrength/拉伸强度–Elongation/延伸率–Electricalresistivity/电阻系数SOLDERALLOYMELTINGRANGESALLOYMELTINGRANGETIN-LEAD°F°CSn63Pb37361183Sn60Pb40361-374183-190Sn55Pb45361-397183-203Sn50Pb50361-420183-214Sn45Pb55361-440183-225Sn40Pb60361-460183-238Sn35Pb65361-477183-247Sn30Pb70361-496183-258Sn25Pb75361-514183-268Sn20Pb80361-536183-280Sn10Pb90514-576268-302Sn05Pb95574-597301-314LEAD--444221-229Sn95Ag05430-473221-245100%Sn450232Sn95Sb05450-464232-240OTHERALLOYSSn62Pb36Ag02354-372179-189Sn60Pb36Ag04354-475179-246Sn10Pb88Ag02514-570268--574296--325144-163Flux/助焊剂•Fluxisusedtopreparemetallicsurfacestobesoldered/助焊剂通常是用于使金属表面形成有效頒的焊接•Fluxprovidesaheatstablemediumwhichfacilitatessolderingoperations/助焊剂提供了稳定的高温媒介便于焊接的进行•Threemainfunctions:/三个主要功能–Removesoxides/去除氧頿化物–Protectsthesurfacefromre-oxidation/防止焊料頔表面再次被氧頿化–Reducesthesurfacetensionofsolder/减小焊料頔表面