文档介绍：Basic of Solder Paste and
SMT Implementation Process
焊锡膏基础知识和SMT 应用工艺
Fred Ke
Technical service Assistant Manager
Eunow Electronic Materials(Suzhou)Co.,Ltd
(0086)-512-66076290 Ext:847
kell@
Solder Paste and
SMT Implementation Process
焊锡膏基础知识和SMT 应用工艺
Basic of Solder Paste/焊锡膏基础知识
1. Fundamentals of Soldering/锡焊原鞝理
2. Solder Paste Constituents/焊锡膏成分
3. QC test of Solder Paste Attributes/焊锡膏特顠性的测试方法
SMT Implementation Process/SMT 应用工艺
4. Talk about printing process/浅谈印刷工艺
5. Reflow Operations/炉温曲线的设定
6. SMT Troubleshooting/SMT 常见问閑题阩的处理
Section 1: Fundamentals of Soldering
第一章节:锡焊原鞝理
1. Solder/焊料頔
2. Flux/助焊剂
3. Heat/热能
Solder/焊料
• Solder is an alloy of 2 or more metals/通常焊料頔是由两种或两
种以上的金属合金组成的
• Soldering is a process that joins two metallic surfaces/锡焊
实际闄是两种金属的表面形成有效頒连接的过程
• Temperatures typically below 600 °F (316 °C)/温度通常低于华
氏600 度(摄氏316 度)
Typical Metals Used in Solder Alloys
通常焊料頔合金使用的金属
• Tin (Sn)/锡• Lead (Pb)/铅
• Silver (Ag)/银• Copper (Cu)/铜
• Bismuth (Bi)/铋• Indium (In)/铟
• Antimony (Sb)/锑• Zinc (Zn)/锌
position/合金成分
• Many different elements can bined in an endless number of
combinations./大多数不同的元素可以组成无限数量的化合物
• bination will have its own physical properties./每种化合
物都有其自己的物理特顠性
• Common Physical Properties used to distinguish solders are:/通常
用于区分焊料頔的物理特顠有:
– Melting Point/熔軙点
– Tensile Strength/拉伸强度
– Elongation/延伸率
– Electrical resistivity/电阻系数
SOLDER ALLOY MELTING RANGES
ALLOY MELTING RANGE
TIN-LEAD °F °C
Sn63Pb37 361 183
Sn60Pb40 361 - 374 183 - 190
Sn55Pb45 361 - 397 183 - 203
Sn50Pb50 361 - 420 183 - 214
Sn45Pb55 361 - 440 183 - 225
Sn40Pb60 361 - 460 183 - 238
Sn35Pb65 361 - 477 183 - 247
Sn30Pb70 361 - 496 183 - 258
Sn25Pb75 361 - 514 183 - 268
Sn20Pb80 361 - 536 183 - 280
Sn10Pb90 514 - 576 268 - 302
Sn05Pb95 574 - 597 301 - 314
LEAD-FREE
430 221
Sn96Ag04 430 - 444 221 - 229
Sn95Ag05 430 - 473 221 - 245
100%Sn 450 232
Sn95Sb05