文档介绍：分类号学号 D200777177
学校代码 10487 密级
博士学位论文
高密度封装中互连焊点的热迁移研究
学位申请人: 陶媛
学科专材料学
指导教业: 吴懿平教授
答辩日期师: : 2011 年 12 月 23 日
A Dissertation Submitted in Fulfillment of the Requirements for the
Degree of Doctor of Philosophy in Engineering
Research on thermomigration in the interconnection solder
joints in high density electronic packaging
Candidate : Tao Yuan
Major : Material Science
Supervisor : Prof. Wu Yiping
Huazhong University of Science and Technology
Wuhan, Hubei 430074, P. R. China
December, 2011
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华中科技大学博士学位论文
Abstract
With the miniaturization trend and functional demand in high-density microelectronic
packaging, the thermomigration (TM) in flip chip solder joints due to the serious joule heating
es a major reliability issue in recent years. This thesis presents a study of TM apparatus
and specimen design, as well as the TM investigation in the eutectic SnPb solder bulk and
composite SnPb flip chip solder bumps at both high and low ambient temperatures.
In order to carry out the TM experiment separated from EM behavior in the solder layer,
a novel apparatus, which consists of two temperature controlled heating rods and a Peliter
cooler to serve as the heating source and heat sink respectively, has been developed. Four
types of sandwich specimen with Cu/Solder/Cu structure have also been designed to match
the apparatus well. FE simulation shows that the thermal gradients across the solder layers in
all these specimens can rise up to be higher