文档介绍：&(PCB分类):Singlesidedboard(单面板)DoublesidedBoard(双面板)MultilayerBoard(多层板)Rigidboard(冈I」性板)flexibleboard(挠性板)flex-rigidboard(刚挠结合板)metalbasePCB(金属基板)Blindboard(盲孔板)buriedboard(埋孔板)bareboard(裸板)Quickturnprototype(样板)PCBMaterial(PCB材料):L)(覆铜板)PREPREG(半固化片)Epoxyresin(环氧树脂)Copperfoil(铜箔)PTFE(Polytetralluoetylene)Teflon(聚四氛乙烯)onstant(介电常数)Flexiblecopperclad(挠性覆铜板)silverfilm(银盐片)diazofilm(重氮片)Soldermask(阻焊)Dryfilm(干膜)legendink(字符油墨)peelablesoldermask(可剥离阻焊)flux(助焊剂)additive(添加剂)PCBProcess(PCB生产流程):Wetprocess(湿法流程)Dryprocess(干法流程)FORMULTILAYERMANUFACTUREPROCESS(多层线路板生产流程):Laminatecut(覆铜板)scrubbing(擦板)Imagetransfer(图形转移)internallayer(内层)Exposure(曝光)Developing(显彩)ETCHINGC蚀亥<J)black/brownoxygen(黑/棕化)layup(叠层)Laminating(层压)Drilling(钻孔)scrubbing(擦板)Platedthroughhole(孔金属化)PTHpanelplating(板面电镀)patternplating(platedresist)(图形电镀)Etching(蚀刻)Inspection(检验)Printingsoldermask(阻焊印刷)Exposure(曝光)Developing(显影)HotCured(热固化)HotAirLeveling(热风整平)IMMERSIONGOLD(沉金)Printinglegendink(silkscreenprinting)(字符印刷)HotCured(热固化)Routing(铳外形)punch(冲孔)Bareboardtesting(裸板测试)FinalInspection(终检)Packing(包装)Delivery(发货)Watertreatment(水处理)DI(dialysision)water(去离了水)Wastewatertreatment(污水处理)humidity(湿度)temperature(温度)PCBInspection(PCB检验):Inspectionstandard(检验标准)defectopen(开路)short(短路)measling(A斑)fibreexposure(漏基材)holebreakout(破孔)flatness(平面度)peelstrength(剥离强度)th