文档介绍：PCBA半成品握持方法--------------------------------------------------------1-3PCBAWIPHandingSMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件X方向)------------------1-4SMDAssemblyworkmanshipcriteria--ponentalignment(XAxis)SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件Y方向)------------------1-5SMDAssemblyworkmanshipcriteria--ponentalignment(YAxis)SMT零件組裝工藝標準--圓筒形(Cylinder)零件之對準度------------------------1-6SMDAssemblyworkmanshipcriteria--ponentalignmentSMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳面之對準度-----------------------1-7SMDAssemblyworkmanshipcriteria--Gull-WingfootprintalignmentSMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳趾之對準度-----------------------1-8SMDAssemblyworkmanshipcriteria--Gull-WingtoealingnmentSMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳跟之對準度-----------------------1-9SMDAssemblyworkmanshipcriteria--Gull-WingheelalingnmentSMT零件組裝工藝標準--零件腳面(2302)之對準度-------------------1-ponentfootprint(2302)alignmentSMT零件組裝工藝標準--J型腳零件對準度---------------------------------------1-11SMDAssemblyworkmanshipcriteria--JtypeleadalignmentSMT焊點性工藝標準--鷗翼(Gull-Wing)腳面焊點最小量---------------------------1-12SMDsolderjointworkmanshipcriteria--MinimumsolderofGullWingfootprintSMT焊點性工藝標準--鷗翼(Gull-Wing)腳面焊點最大量---------------------------1-13SMDsolderjointworkmanshipcriteria--MaximumsolderofGullWingfootprintSMT焊點性工藝標準--鷗翼(Gull-Wing)腳跟焊點最大量---------------------------1-14SMDsolderjointworkmanshipcriteria--MinimumsolderofGullWingHeelSMT焊點性工藝標準--J型接腳零件之焊點最小量---------------------------------1-15SMDsolderjointworkmanshipcriteria--MinimumsolderofJtypeleadSMT焊點性工藝標準--J型接腳零件之焊點最大量工藝水準點-----------------------1-16SMDsolderjointworkmanshipcriteria--MaximumsolderofJtypeleadSMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)--------------1-17SMDsolderjointworkmanshipcriteria--ponent(3or5faceterminations)SMT焊點性工藝標準--晶片狀(Chip)零件之最大焊點(三面或五面焊點)--------------1-18SMDsolderjointworkmanshipcriteria--ponent(3or5faceterminations)SMT焊錫性工藝標準--焊錫性問題(錫珠、錫渣)---------------------------------1-19SMDsolderjointworkmanshipcriteria--Othersolderissue(solderball,solderdross)DIP零件組裝工藝標準--臥式零件組裝之方向與極性------------------------------1-po