文档介绍：IPC -A- 600x (Class II) Acceptability of Printed Circuit ’ s. An IPC publication. IPC -A- 610x (Class II) ANSI/IPC -A- 610 Acceptability of Electronic Assemblies. An IPC publication. AVL Approved vendor/er List 客户认可代理供应商 MPI Manufacturing Process Instruction AML Approved Manufacturer List 客户指定供应商 MRB Material Review Board 物料反馈会议 AOI Automated Optical Inspection 自动光学检查 ODM Original Desing Manufacturing AQL Acceptable Quality Level OBA Out of Box Audit 开箱检查 COC Certification of conformance OEM Original Equipment Manufacturer BGA Ball Grid Array Integrated Circuit OQA Ongoing Quality Audit 出货检查 IC Integrated Circuit 集成电路 ORT Ongoing Reliability Testing 老化测试 IPC 国际线路把板装配工艺接受标准 PCBA Printed Circuit Board Assembly CAR Corrective Action Request 正确的改善行动 PCB Printed Circuit Board OSP RH Relative humidity 相对湿度 anic solderability preservative 有机可焊性保护 CEM Contract Electronics Manufacturer Loading list SMT 贴片机器对料单 CM Contract Manufacturer 合约制造商 QFP Quad Flat Pack 方型扁平封装方式如 BGA, 封装方式 SP//SOT/SOJ CSP 芯片级封装 CPE Customer Product Evaluation PS Production synchronization 产品同步化 DPPM Defects in Parts Per Million PM Production maintenance 生产维护 ESD Electro Static Discharge 静电释放 ECO Engineering change order 工程更改单 CP Process capability 制程能力指数 RMA 中等活性松香型号 RA 活性松香型 CPK 反映规格限间制程的能力制数 SMD Surface Mount Device FCT/FT Functional Test 功能测试 SMT Surface Mount Technology 表面贴装技术 SPC Statistical process control 过程统计控制 uBGA Micro - Pitch Ball Grid Array ICT In Circuit Test 在线测试 VMI Visual - Mechanical Inspection 肉眼检查 EMS Electronic Manufacturing Server Checklist 生产线文件工位对照单 LCR Inductance Capacitance Resistance 电感/容/阻 FIFO First in first out 先进先出 ME Manufactering engineering dept. LCD Liquid crystal display 液晶显示器 MI Manual insert 手工插件 VF Virtual factory 虚拟工厂 NPI New product instruction WI Work instruction 操作指示 PMP Process management plan 工艺管理计划 BOM bill of material 物料清单 DA Deviation 工程偏差 ECR Engineering change report EVT Engineering verift test 工程评估测试 ECN Engineering change note DVT Desing verif