文档介绍：IPC-7721 Change 1 Pages March 2000
THE INSTITUTE FOR Repair and Modification
INTERCONNECTING of Printed Boards and
AND PACKAGING
ELECTRONIC CIRCUITS Electronic Assemblies
Developed by the Printed Board Repair Task Group (7-34a) of the
Institute for Interconnecting and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847
Fax 847
March 2000 IPC-7721
Acknowledgment
Any Standard involving plex technology draws material from a vast number of sources. While the principal members of the
IPC Printed Board Repair Task Group (7-34a) of the Product mittee are shown below, it is not possible to include
all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.
Product Assurance Printed Board Repair Technical Liaisons of the
Committee Task Group IPC Board of Directors
Chairman Chairman Vice Chairman
Mike Hill Jeff Ferry Christine Miller Stan Plzak Peter Bigelow
Viasystems Technologies Corp. Circuit Technology FORE Systems, Pensar Corp. Beaver Brook
Center, Inc. Inc. Circuits Inc.
A Special Note of Appreciation
The following core group has Ferry, Jeff, Circuit Technology Miller, Christine A., FORE
volunteered much of their time and Center, Inc. Systems Inc.
have made significant contributions Foster, Daniel L., PACE Inc. Moffitt, James H., Moffitt Consulting
to this document. Hersey, Ralph J., Ralph Hersey & Services
Associates Norton, John S., Tektronix Inc.
Blakley, Peggi, NSWC Crane
Brock, Ron, NSWC Crane Hopkins, Reed, Metcal Inc. Siegel, Eric, PACE, Inc.
Day, Jennifer, Soldering Technology Houghton, . Bruce, Celestica
International Corporation
Printed Board Repair Task Group
Anderson, Kari, Hughes Technical Dennehy, Charles S., Circuit Hiett, Carol E., Lockheed Martin
Services Co. Technology Center