文档介绍：pcb板制作工艺流程介绍
Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
Cu plating
Hole plugging
Pattern imaging
Lamination
Laser Ablation
Mechanical drilling
Pattern imaging
Cu plating
Solder Mask
Surface Finished
Routing
Visual inspection
Electric test
Shipping
Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
Desmear
Cu plating
Hole plugging
Cu plating
Belt Sanding
Lamination
Laser Ablation
Mechanical drilling
Cu plating
Pattern imaging
Solder Mask
Gold plating
Routing
Electrical test
Pattern imaging
Hole counter
Shipping
Visual inspection
(THIN CORE)
Laminate
Copper Foil
裁板(Panel Size)
COPPER FOIL
Epoxy Glass
Photo Resist
2.